Esec Programmable g Ultrasonic Module (PUM) Advantages in Your Production IGBT Power w SO MOSFET E The new Programmable Ultrasonic Module (PUM) meets these challenges, combining solder pattern writing with enhanced wetting by applying ultrasonic energy to the liquid solder. While the amount of solder is precisely controlled with the dual wire dispenser, the geometry of the final solder pattern is the result of a writing movement of the ultrasonic transducer tip. Both are part of the product recipe, making the solder pattern easily reproducible. Future Proof Equipment The dimensions of the solder pattern are crucial for good process quality. Good control of bond line thickness (BLT) and solder distribution, minimum die to pad and die to die distance are difficult to achieve. Besides that, some new Zn based high temperature Pb-free solder materials are more difficult to dispense properly due to their wetting behavior. Superior Process, Drastically Reduced Tooling Costs Solder pattern size and target BLT adjusted without tool change Full pad coverage, no geometrical limitations Superior wetting with US power Small and well distributed voids Upgradeable on Esec 2009 SSIE and Esec 2009 fSE SAME PROVEN OVEN & ATMOSPHERE Patent Pending SAME PROVEN WIRE DISPENSE PROCESS SAME PROVEN BOND PROCESS

www.besi.com - salesEbesi.com Pattern Definition • Programmable pattern geometry with versatile pattern editor • Predefined patterns available • One transducertipsizeforawide range of chipdimensions Pb-free Solder • Works for all common Pb-free solders • Solder to solder clearance < 0.25 mm • Works for all common Pb-based solders Indium Solder • Typical void rate 4% (single void < 0.3%) Solder Dispersing • Precisely dispersing the solder to the perimeter of the pad • BLT is mainly controlled by amount of wire dispensed • Samples shown were made with same transducer tip ■ Example: PbSn2Ag2.5 on...