Esec DB 2100 FC
2Pages

Catalog excerpts

Esec DB 2100 FC Future Proof Equipment Driving Innovation Flip chip in high volume production means more cost pressure, both in investment and in operating cost. Flip chip bonding on low cost substrates like metal leadframes and thin laminate strips is seeing fast growth. Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders – an aggressive approach to driving down the cost of flip chip technology. •• 0µm placement accuracy at highest speed 1 •• ull process control - Highest yield F •• uickest device changeover Q •• educed Operating cost - 2100 Platform Synergies R Lowest Cost of Ownership mass production flip chip bonding FULL PROCESS PROCESS CONTROL CONTROL ACCURACY PLUS HIGHEST OUTPUT

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PROCESS CONTROL Full Process Control ACCURACY PLUS •• Real-time post-bond inspection (PBI) for coarse placement verification without uph loss •• Automatic flux imprint function •• Real-time touch down check at flux and bond to avoid non-wet issues and cold solder joints •• 10 µm @ 3σ •• High productivity, Highest yield •• Enhanced camera system •• Improved temperature drift compensation Highest Output •• Simultaneous movement of chip and camera •• Low vibrations – no time wasted for motion settling •• Optimized for strip based products - up to 8000 UPH with 100% PBI •• Full recipe transfer...

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