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Esec DB 2100 DS

Product catalog summary

Overview
The document describes the Esec 2100 DS, a high-end die bonder machine designed for diffusion soldering and sintering. It combines advanced pick & place technology with a flexible hot tunnel indexer, suitable for use with forming gas or N2 atmosphere.

Flexibility and Capability

High productivity and accuracy of 25 μm at 3σ.
Easy conversion between different leadframe types and recipe portability.
Supports ultra-thin die capability, ensuring void-free and stress-free operations to prevent die cracks.

Speed & Accuracy

Features a superior "light & rigid" pick & place design.
High performance Y-axis and new voice coil driven P&P X-axis.
Enhanced P&P Z-axis and bond head interface with advanced real-time trajectory controller.

Machine Climate

Includes cooling air and gas flow supervision with controlled laminar air flow.
Hot forming gas extraction capabilities.

Oven and Atmosphere

Programmable gas flow with accurate and flexible temperature profile settings.

Machine Dimensions

Footprint: 1785 x 1448 x 1400 mm.
Weight: approximately 1750 kg.

Supply Requirements

Voltage: 208 - 230 VAC at 47 - 63 Hz.
Power rating: 5800 VA.
Compressed air: minimum 5.2 bar.
Vacuum: minimum -0.75 bar.
Forming gas: minimum 2.5 bar.

Flexible Hot Tunnel Strip Handler

Fully programmable with four independent transport clamps.
Fast exchangeable bond clamp concept.

Wafer and Die Dimensions

Wafer size: 4” - 12”.
Frame size: 8” - 12”.
Die size: 0.5 - 20 mm.
Die thickness: > 0.75 mm.

Leadframe Size

Width: 9 - 84 mm (100 mm option).
Length: 90 - 300 mm.
Thickness: 0.1 - 2.5 mm.

Process

Bond force: 0.2 - 50 N.
Bond rotation: 360°.
Four programmable heating zones.

Accuracy / Productivity

For >2 mm: 25 μm / 0.2° (3σ).
For 0.5 - 2 mm: 20 μm / 0.5° (3σ).
MTBF: > 200 hours.

Catalog excerpts

Esec DB 2100 DS Driving Innovation The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place Future Proof Equipment and a flexible hot tunnel indexer with forming gas or N2 atmosphere. The Esec 2100 DS guarantees to be the most flexible and capable die bonder for diffusion soldering and sintering for the time to come. Flexibility and Capability • Best productivity • Accuracy: 25 μm @ 3σ • Easy conversion between different leadframe types • Recipe portability • Ultra thin die capability • Void free • Stress free, prevent die cracks FLEXIBLE HOT TUNNEL STRIP HANDLER OVEN & ATMOSPHERE SPEED & ACCURACY MACHINE CLEAN CLIMATE MACHINE

Open the catalog to page 1

www.besi.com - [email protected] Speed & Accuracy Machine Climate • Superior “light & rigid” P&P design • Excellent accuracy at maximum speed • High performance Y-axis • New voice coil driven P&P X-axis • Enhanced P&P Z-axis and bond head interface • Advanced real time trajectory controller • Cooling air and gas flow supervision • Controlled laminar air flow • Extraction of hot forming gas Flexible Hot Tunnel Strip Handler • Fully programmable strip handler • Four independent transport clamps • Fast exchangable bond clamp concept • Programmable gas flow • Accurate and flexible temperature profile...

Open the catalog to page 2

Esec DB 2100 DS

Esec DB 2100 DS

Catalog excerpts

All BE Semiconductor Industries N.V. catalogs and technical brochures

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