Esec DB 2009 SSIE Future Proof Equipment Today’s power devices used in communications, automotive, computers, home appliances and handheld devices have entered a new era of miniaturisation. This development requires more power dissipation in small packages and asks for a more stringent process control. Esec is teaming up with key customers and major material suppliers to forge an optimum power packaging solution. Such close cooperation led to the new soft solder Die Bonder 2009 SSIE from the soft solder world market leader. • New dispense system • Best process control • Product inspection The soft solder DB 2009 SSIE is engineered for a variety of packages like SOT, SOD, SO, PSSO, PSOP, DPAK, TO, PQFN, Power LED and power modules on one platform. Our leading edge patented process technology and our dedication to provide solutions to our customers, help to produce power devices at the lowest price and highest performance. Solution Provider for Power Package • High bond force (150N) • 300mm capability • Special applications (boat and reel-to-reel handling) Soft solder DIE BONDING PATTERN WRITING VISION ALIGNMENT VISION ALIGNMENT PATTERN DISPENSING QUICK EXCHANGE PRODUCT INSPECTION QUICK EXCHANGE PRODUCT INSPECTION OVEN AND ATMOSPHERE POINT TO LINE PICK & PLACE POINT TO LINE PICK & PLACE OVEN & ATMOSPHERE

PATTERN WRITING QUICK EXCHANGE Pattern Dispensing •• New dispense process •• Programmable pattern size and BLT (tool-less) •• Full pad coverage, no geometrical limitations •• Superior wetting •• Upgradable on all 2009 SSIE Quick Exchange •• Extended application range •• Quick exchange indexers •• Leadframe conversion kits •• Boat and reel-to-reel handling •• Multi die and multi pass bonding •• Lowest gas consumption •• Uniform gas flow •• Accurate and flexible temperature profile settings VISION ALIGNMENT Vision Alignment •• 300mm wafer handler option •• Reliable thin die handling •• High accuracy...