The development of the Esec DB 2009 fSE is based on more than 30 years of experience. One important contributor to lowest cost of ownership is the significant reduction of gas consumption of up to 50% compared to competing systems, which means massive savings in operating costs every day. The ever more demanding market requirements led to the evolution of the Die Bonder 2009 fSE, the fastest soft solder die bonder in the industry with a broad application range. First to mention is the pointto-line Pick & Place with stationary indexer, which enables increased throughput and productivity. Furthermore, the Die Bonder 2009 fSE handles both single row and matrix leadframes, as well as a wide variety of packages like SOT-23, SOT-223, SOT-89, TO-92, TO-126, TO-220 and DPAK devices. The optional leadframe conversion kits offer an effective solution for future changes in the product mix. Future Proof Equipment Fastest Soft Solder Die Bonder with a Wide Application Range Increased Throughput & Productivity Enhancements • New dispense system •• Best process control •• Significantly higher throughput for matrix leadframes Low cost operation PATTERN WRITING POINT TO LINE PICK & PLACE PATTERN DISPENSING POINT TO LINE PICK & PLACE QUICK EXCHANGE QUICK EXCHANGE OVEN AND ATMOSPHERE OVEN & ATMOSPHERE

PATTERN WRITING QUICK EXCHANGE Pattern Dispensing •• New dispense process •• Programmable pattern size and BLT (tool-less) •• Full pad coverage, no geometrical limitations •• Superior wetting •• Upgradable on all 2009 fSE Quick Exchange •• Extended application range •• Quick exchange indexers •• Leadframe conversion kits •• Multi die and multi pass bonding •• Uniform gas flow •• Accurate and flexible temperature profile settings POINT TO LINE PICK & PLACE Point to Line Pick & Place •• Highest throughput with matrix leadframes •• Individually programmable pick and bond force Productivity / Process...