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Esec 2100 xPplus

Product catalog summary

Overview
The Esec 2100 xPplus is a high-speed 12” epoxy die bonder featuring the revolutionary Phi-Y pick-and-place system, which significantly enhances speed and accuracy. Standard accuracy is 20 μm, with an optional improvement to 15 μm.

Key Features

Speed and Accuracy: Minimal distances between pick and bond positions, coupled with a stiff symmetrical bondhead and vibration compensation, result in the fastest settling times.
Flexibility: Suitable for all epoxy packages, ensuring high process quality and yield.
Future Proof: Designed to accommodate future technological advancements.

Technological Innovations

Double YhS Pattern: Enhances process speed and quality, suitable for medium-sized rectangular dice.
Clean Machine: ISO class 5 environment reduces airborne particles, ideal for CIS applications.
2nd Generation Vision System: Improved image quality and recognition with reduced transfer time.
High Precision Bonding: Enhanced placement accuracy with optimized dynamics and auto-correction features.
Strip Thickness Compensation: Provides excellent bond line thickness control without impacting UPH.

Specifications

Machine Dimensions: 1785 x 1448 x 1400 mm, approx. 1400 kg.
Supply Requirements: Voltage 208 - 230 VAC, power rating 800 - 1.100 VA, compressed air min. 5.2 bar, vacuum min. -0.75 bar, nitrogen blow 1.8 - 6 bar.
Wafer and Die Dimensions: Wafer size 4” - 12”, die size 0.5 - 20 mm, thickness > 0.75 mm.
Leadframe Size: Width 9 - 84 mm, length 90 - 300 mm, thickness 0.1 - 2.5 mm.
Process: Bond force 0.2 - 50 N, bond rotation 360°, heating at bond for WBC & Simple WBL.
Accuracy/Productivity: >2 mm: 20 μm / 0.2°, optional 15 μm / 0.2°; 0.5 - 2 mm: 20 μm / 0.5°; MTBF > 200h.

Catalog excerpts

Esec 2100 xP The Fastest 12” Epoxy Die Bonder Future Proof Equipment The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 μm. Optionally, the accuracy can even be improved, down to 15 μm. Minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the plus unsurpassed speed of the Die Bonder Esec 2100 xP . CLEAN MACHINE Standard accuracy 20 μm Optional 15 μm accuracy (at highest speed) Fastest Time to Yield Highest uptime Flexible platform for all epoxy packages Process Quality for Highest Yield 2nd GENERATION VISION SYSTEM HIGH PRECISION BONDING STRIP THICKNESS COMPENSATION

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www.besi.com - salesEbesi.com • Good quality at double process speed • Better tailing characteristics • Best suitable for medium sized rectangular dice Clean Machine • ISO class 5 (class 100) inside machine • Reduces airborne particle through laminar flow 2nd Generation Vision System • Good image quality with improved signal to noise ratio • Reduced image transfer time • Better recognition with new image sensor Strip Thickness Compensation \ Strip thickness based Z-height correction Excellent bond line thickness control No UPH impact and easy setup Optionally available High Precision Bonding...

Open the catalog to page 2

Esec 2100 xPplus

Esec 2100 xPplus

Catalog excerpts

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