Esec 2100 xP The Fastest 12” Epoxy Die Bonder Future Proof Equipment The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 μm. Optionally, the accuracy can even be improved, down to 15 μm. Minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the plus unsurpassed speed of the Die Bonder Esec 2100 xP . CLEAN MACHINE Standard accuracy 20 μm Optional 15 μm accuracy (at highest speed) Fastest Time to Yield Highest uptime Flexible platform for all epoxy packages Process Quality for Highest Yield 2nd GENERATION VISION SYSTEM HIGH PRECISION BONDING STRIP THICKNESS COMPENSATION

www.besi.com - salesEbesi.com • Good quality at double process speed • Better tailing characteristics • Best suitable for medium sized rectangular dice Clean Machine • ISO class 5 (class 100) inside machine • Reduces airborne particle through laminar flow 2nd Generation Vision System • Good image quality with improved signal to noise ratio • Reduced image transfer time • Better recognition with new image sensor Strip Thickness Compensation \ Strip thickness based Z-height correction Excellent bond line thickness control No UPH impact and easy setup Optionally available High Precision Bonding...