Esec 2100 sDplus
2Pages

Catalog excerpts

Future Proof Equipment Driving Innovation The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y Pick and Place with the new 2nd generation vision system. With the Parallel Pick & Place (PPP) option it also provides parallel picking and bonding which increases productivity for ultra-thin die plus applications and improves the process quality. The DB 2100 sD guarantees to remain to be the most flexible and capable Die Bonder for high end devices for the time to come. MEMS Flash memory • Best ultra thin die productivity • Void free • Stress free – prevents die cracks • Accuracy 10 µm @ 3σ • Best standard die productivity • Common die bonding process • Standard accuracy: 15 µm @ 3σ • High Accuracy Mode: 12 µm @ 3σ Parallel Pick & Place Single Pick & Place The only Two-in-One Die Bonder high end DIE BONDING ULTRA THIN ULTRA THIN DIE PICKING DIE PICKING PARALLEL PARALLEL PICK&PLACE PICK&PLACE HIGH PRECISION BONDING 2nd GENERATION VISION SYSTEM CLEAN CLEAN MACHINE MACHINE

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PARALLEL PICK&PLACE Parallel Pick & Place ULTRA THIN DIE PICKING Ultra Thin Die Picking •• Two-in-One machine: Instant switching between parallel and standard bond mode •• Parallel picking and bonding •• High throughput for ultra thin die •• o heat transfer back to wafer N •• Scalable snap-in modules for easy conversion •• Multi-Needle Module (UTD-N) •• lider Module (UTD-P) S •• ulti Disc Module (UTD-M) mode with freely programmable M sequence 2nd Generation Vision System •• Image quality with improved signal to noise ratio •• ast vision axis movement, reduced image transfer time F •• etter...

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