Catalogs >
BE Semiconductor Industries N.V. >
Esec 2100 sDadvanced

Esec 2100 sDadvanced
2Pages

Catalog excerpts

Esec 2100 sDadvanced The Next Generation High End Die Bonder The latest member of the field proven High-end Esec 2100 sD machine family is featuring the new 3rd Generation High Resolution Vision System, a completely redesigned clean unit as well as new easy to use GUI . Future Proof Equipment The new Esec 2100 sDadvanced Die Bonder is able to handle the most challenging thin die and warped strip packages. The proven “light & rigid” structure of the Pick&Place ensures highest accuracy and maximized throughput. This fine piece of Esec High-end Equipment quarantees maximum flexibility and outstanding process capabilities meeting today’s and tomorrow’s requirements. MEMS Flash Next Generation Two in One Die Bonder • Two in one machine configuration. Single Pick&Place and additional Parallel Pick&Place • Instant switching between Parallel Pick&Place and single Pick&Place mode • New transfer table axis in parallel module with significant higher axis performance • Excellent standard die productivity • Superior ultra thin die productivity 3 GENERATION VISION SYSTEM rd CLEAN CLEAN MACHINE MACHINE

Open the catalog to page 1

www.besi.com - sales@besi.com CLEAN MACHINE Speed & Accuracy • Superior “light & rigid” P&P design • Voice coil drive X axis • Enhanced Z axis with integrated encoder • High performance Y axis with optional Liquid Cooling System • Advanced Real time Trajectory Controller • High Accuracy Mode • High Flow Bond Head • Air flow from front to back • Programmable air flow from 3 to 12 qm • Standby mode if no strip loaded • ULPA filter available • ISO class 4 (with clean speed) • Additional anti contamination, remove dust and particles kit available 3rd Generation Vision System • High resolution 4...

Open the catalog to page 2