Esec 2100 hS ix Future Proof Equipment The New Generation High Speed Die Bonder The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use motorized and programmable rail strip handler. It also incorporates the proven features of the 2100 i generation, such as the High Resolution Vision Systems and the Dual Dispensing Module. The Esec 2100 hS ix is the new generation High Speed Die Bonder providing now the best Cost of Ownership (CoO). Process Quality at Even Higher Speed • Productivity up to 18500 UPH • High speed soft pick and bond processes • Motorized and programmable rail strip handler • Dual Dispensing Module with independent writing axes • High Resolution Vision System with Up Looking Vision Option • Low Contrast Kit enables the vision to detect almost anything HIGH RESOLUTION CAMERAS OPTIMIZED PROCESS CONTROL

www.besi.com - [email protected] Optimized Productivity • High Resolution 4 mega pixel Vision Systems • Motorized and Programmable Rail Strip Handler with three clamps, optimized for scratch free production • New reliable Strip push out to Magazine by Clamp • New Dual Universal Top Stack and Magazine Input Handler • New All-in-One Expansion unit for all frame sizes • Motorized Rail Strip Handler allowing working position as close to Wafer as possible • Superior and proven P&P design with High Performance P&P Y-axis and speed optimized trajectories • Speed Optimized Soft Pick and Bond Processes •...