Esec 2100 hSi / sD advanced i Package 2 Refining the Intelligent Die Bonders Future Proof Equipment The Esec 2100  i Die Bonder family is further enhanced with the new Bond Height Measurement System to inspect Die Tilt, Bond Line Thickness and Filet Height directly at the Bond Position. Automated Bond Head Tilt Adjusting as well as Dispense and Bond Tool Auto-optimizing bring automation to the next level. Unmatched Process Accuracy is assured with the Device Height Sensor, High Precision Bond Head and High Resolution Vision Systems which include Up Looking Systems. And not to be missed is the Dual Dispensing Module with its unbeatable productivity. Versatile, Accurate, Productive, Automated • On spot Die Tilt, Bond Line and Filet Height Measurement • Dual Dispensing Module with Dispense Volume Control • Automated Tool Optimization to eliminate operator dependency • Ultra precise bonding with Device Height Sensor and High Precision Bond Head • High Resolution Vision System including Up Looking Vision and Low Contrast Kit to detect almost anything INTELLIGENCE IN PROCESS CONTROL INTELLIGENCE IN PROCESS INSPECTION INTELLIGENCE IN PRODUCTIVITY INTELLIGENCE IN

www.besi.com - [email protected] • Dual Dispensing Module with independent writing axes • Dual 5 bar Pneumatic Dispense System Controller • Superior and proven “light & rigid” P&P design • High Performance P&P Y-axis with Liquid Cooling System • High Performance 4th Generation Vision System • High Speed Production Mode with excellent accuracy • Device Height Sensor for extreme Z-Height Control • High Precision Bond Head with highly accurate Theta-axis • High accuracy closed loop P&P Z-axis • High Resolution 4 Megapixel Vision Systems • New High Resolution Up Looking Vision System • High Accuracy...