Esec 2100 hS The Next Generation High Speed Die Bonder The Esec 2100 hS is the first model of the 2100 Die Bonder GEN3 family featuring yet another engineering master piece. Future Proof Equipment A new Pick & Place generation using a “light & rigid” structure, which in conjunction with advanced trajectory control and optional Liquid Cooling, delivers a significantly higher performance. In addition, a new versatile Substrate Handler Family is introduced adapting to all needs of High Speed Epoxy Die Bonding. The Esec 2100 hS is a highly scalable High Speed Die Bonder providing the best possible Cost of Ownership (CoO). Process Quality at Highest Speed • Productivity up to 18 500 UPH • Standard accuracy: 20 µm @ 3 σ • High Accuracy Mode: 15 µm @ 3 σ • Versatile substrate handler concept • Scalable performance & application range • Highest uptime SPEED & ACCURACY SCALABLE & CONFIGURABLE

www.besi.com - [email protected] Speed & Accuracy Scalable & Configurable • Superior “light & rigid” P&P design • Excellent accuracy at maximum speed • High performance Y-axis with optional Liquid Cooling • New voice coil driven P&P X-axis • Enhanced P&P Z-axis and bond head interface • Advanced real time trajectory controller • New versatile substrate handler 2 family (SH2) • Scalable performance & application range • Strip handler with rail or various plate designs • Wide range of strip loading and unloading options • 1 Zone extended heating option for efficient heat transfer • Ability to upgrade...