Introduction
The document discusses the Esec 2100 FC hS, a flip chip bonder designed for high-volume production, emphasizing cost efficiency and innovation. It highlights the integration of flip chip capabilities into the 2100 family to reduce costs.

Specifications
- Placement Accuracy: 10µm at highest speed.
- Process Control: Full process control ensuring high yield and quick device changeover.
- Operating Cost: Reduced due to platform synergies.
- Output: Optimized for strip-based products with up to 12,000 UPH including dip fluxing and 100% post-bond inspection.

Process Control Features
- Post Bond Inspection (PBI) without loss of units per hour (UPH).
- Automatic flux imprint monitoring and real-time touchdown checks.
- Flux coverage inspection with a patented fluxer concept.
- Programmable pick/bond force down to 0.2N.

Accuracy Enhancements
- Improved Z-axis guides and bearings for pick and place.
- Placement auto-correction and enhanced thermal drift compensation.
- 2nd generation vision system with improved image quality.

Output Efficiency
- Independent movement of chip and cameras.
- Unique pick and place concept minimizing motion settling time.
- Simultaneous bump alignment and dip fluxing.
- Patented Slide Fluxer concept with integrated up-looking camera.

Ease of Use
- Full recipe transfer between machines.
- PSEUDO X-RAY™ for first die accuracy.
- Quick product conversion without tools.
- Automatic flip head alignment.

Comparison with Other Models
The document compares the Esec 2100 FC hS with other models like Esec 2100 FCplus, Datacon 8800 FC QUANTUMadvanced, and Datacon 8800 CHAMEOadvanced, highlighting differences in local accuracy, global accuracy, maximum strip width, die size, UPH, and lead time.

Conclusion
The Esec 2100 FC hS is positioned as a future-proof, cost-effective solution for high-volume flip chip production, offering advanced process control, accuracy, and ease of use.