Esec 2100 FC hS Driving Innovation Future Proof Equipment Besi as a renowned leader in providing FC bonders for trouble free high quality mass production has integrated flip chip capability into the latest generation of the 2100 family – an aggressive approach to driving down the cost of flip chip technology. ACCURACY ACCURACY PLUS FULL PROCESS PROCESS CONTROL CONTROL • 10µm placement accuracy at highest speed • Full process control - Highest yield • Quickest device changeover • Reduced Operating cost - 2100 Platform Synergies Lowest Cost of Ownership Flip chip in high volume production means more cost pressure, both in investment and in operating cost. Flip chip bonding on low cost substrates like metal leadframes and thin laminate strips is seeing fast growth. HIGHEST OUTPUT

www.besi.com - [email protected] PROCESS CONTROL ACCURACY PLUS Full Process Control • Post Bond Inspection (PBI) without uph loss • Automatic flux imprint monitoring • Real-time touch down check at flux and bond to avoid non-wet issues and cold solder joints • Flux coverage inspection with patented fluxer concept • Programmable pick / bond force down to 0.2N • Improved Pick and Place Z-axis guides and bearings • Placement Auto Correction • 2nd generation vision system with improved image quality • Enhanced thermal drift compensation Highest Output • Independent movement of chip and cameras • Unique...