Esec 2009 SSIE
2Pages

Catalog excerpts

Esec 2009 SSIE Solution Provider for Power Package New Era of Miniaturisation Enhancements New Dispense System Best Process Control Product Inspection PATTERN DISPENSING QUICK EXCHANGE OVEN & ATMOSPHERE The Esec 2009 SSIE is engineered for a variety of packages like SOT, SOD, SO, PSSO, PSOP, DPAK, TO, PQFN, Power LED and power modules on one platform. Our leading edge patented process technology and our dedication to provide solutions to our customers, help to produce power devices at the lowest price and highest performance. Future Proof Equipment Today’s power devices used in communications, automotive, computers, home appliances and handheld devices have entered a new era of miniaturisation. This development requires more power dissipation in small packages and asks for a more stringent process control. Besi is teaming up with key customers and major material suppliers to forge an optimum power packaging solution. Such close cooperation led to the new soft solder Die Bonder Esec 2009 SSIE from the soft solder world market leader. Options High bond force (50 N or 150 N) 300 mm wafer capability Special applications (boat and reel-to-reel handling) VISION ALIGNMENT PRODUCT INSPECTION POINT TO LINE PICK & PLACE

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www.besi.com - sales@besi.com Pattern Dispensing Quick Exchange New dispense process Programmable pattern size and BLT (tool-less) Full pad coverage, no geometrical limitations Superior wetting Upgradable on all 2009 SSIE Extended application range Quick exchange indexers Leadframe conversion kits Boat and reel-to-reel handling Multi die and multi pass bonding Vision Alignment Lowest gas consumption Uniform gas flow Accurate and flexible temperature profile settings 300 mm wafer handler option Reliable thin die handling High accuracy (optical bond centering) Ready for future requirements...

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