*mydirectindustry

Esec 2009 SSIE

Product catalog summary

Introduction
The Esec 2009 SSIE is a solution for power packaging, designed to meet the demands of miniaturization in power devices used across various industries such as communications, automotive, and consumer electronics. Developed by Besi in collaboration with key customers and material suppliers, it offers advanced capabilities for efficient power device production.

Key Features

Versatile Package Compatibility: Supports a wide range of packages including SOT, SOD, SO, PSSO, PSOP, DPAK, TO, PQFN, Power LED, and power modules.
Advanced Process Technology: Patented technology ensures high performance and cost-effective production.
New Dispense System: Features programmable pattern size and BLT, ensuring full pad coverage and superior wetting.
Quick Exchange: Offers extended application range with quick exchange indexers and leadframe conversion kits.
Oven and Atmosphere Control: Provides uniform gas flow and flexible temperature settings with low gas consumption.
Vision Alignment: High accuracy optical bond centering and reliable thin die handling.
Product Inspection: Includes solder pattern inspection and die placement checks for quality control.

Performance and Specifications

Productivity: Net productivity ranges from 2,500 to 8,000 UPH depending on configuration.
Temperature Control: Features 8 zones with temperatures up to 450°C, with a precision of ±5°C.
Bonding Capabilities: Programmable bonding time and force, with options for higher bond forces.
Wafer and Die Handling: Supports wafer sizes up to 12” and die sizes from 0.4 x 0.4 mm to 13 x 13 mm.
Die Placement Accuracy: Achieves ± 60 μm / 0.6° accuracy, improved to ± 50 μm with OBC.
Substrates and Carriers: Maximum substrate dimensions are 280 mm in length and 80 mm in width, with optional 100 mm width.

Machine Dimensions

Footprint: 1970 mm x 1305 mm x 1760 mm
Weight: Approximately 830 kg / 1,830 lb

Conclusion
The Esec 2009 SSIE represents a future-proof solution for power packaging, offering high throughput, precision, and adaptability to meet evolving industry requirements.

Catalog excerpts

Esec 2009 SSIE Solution Provider for Power Package New Era of Miniaturisation Enhancements New Dispense System Best Process Control Product Inspection PATTERN DISPENSING QUICK EXCHANGE OVEN & ATMOSPHERE The Esec 2009 SSIE is engineered for a variety of packages like SOT, SOD, SO, PSSO, PSOP, DPAK, TO, PQFN, Power LED and power modules on one platform. Our leading edge patented process technology and our dedication to provide solutions to our customers, help to produce power devices at the lowest price and highest performance. Future Proof Equipment Today’s power devices used in communications, automotive, computers, home appliances and handheld devices have entered a new era of miniaturisation. This development requires more power dissipation in small packages and asks for a more stringent process control. Besi is teaming up with key customers and major material suppliers to forge an optimum power packaging solution. Such close cooperation led to the new soft solder Die Bonder Esec 2009 SSIE from the soft solder world market leader. Options High bond force (50 N or 150 N) 300 mm wafer capability Special applications (boat and reel-to-reel handling) VISION ALIGNMENT PRODUCT INSPECTION POINT TO LINE PICK & PLACE

Open the catalog to page 1

www.besi.com - [email protected] Pattern Dispensing Quick Exchange New dispense process Programmable pattern size and BLT (tool-less) Full pad coverage, no geometrical limitations Superior wetting Upgradable on all 2009 SSIE Extended application range Quick exchange indexers Leadframe conversion kits Boat and reel-to-reel handling Multi die and multi pass bonding Vision Alignment Lowest gas consumption Uniform gas flow Accurate and flexible temperature profile settings 300 mm wafer handler option Reliable thin die handling High accuracy (optical bond centering) Ready for future requirements Product...

Open the catalog to page 2

Esec 2009 SSIE

Esec 2009 SSIE

Catalog excerpts

All BE Semiconductor Industries N.V. catalogs and technical brochures

Archived catalogs