IGBT Power w SO MOSFET E The development of the Esec 2009 fSE is based on more than 30 years of experience. One important contributor to lowest cost of ownership is the significant reduction of gas consumption of up to 50% compared to competing systems, which means massive savings in operating costs every day. Future Proof Equipment The ever more demanding market requirements led to the evolution of the Esec 2009 fSE Die Bonder, the fastest soft solder die bonder in the industry with a broad application range. First to mention is the point-to-line Pick & Place with stationary indexer, which enables increased throughput and productivity. Furthermore, the Esec 2009 fSE Die Bonder handles both single row and matrix leadframes, as well as a wide variety of packages like SOT-23, SOT-223, SOT-89, TO-92, TO-126, TO-220 and DPAK devices. The optional leadframe conversion kits offer an effective solution for future changes in the product mix. Fastest Soft Solder Die Bonder with a Wide Application Range Increased Throughput & Productivity Enhancements New dispense system Best process control Significantly higher throughput for matrix leadframes POINT TO LINE PICK & PLACE PATTERN DISPENSING QUICK EXCHANGE OVEN & ATMOSPHERE

www.besi.com - [email protected] Pattern Dispensing Quick Exchange New dispense process Programmable pattern size and BLT (tool-less) Full pad coverage, no geometrical limitations Superior wetting Upgradable on all 2009 fSE Extended application range Quick exchange indexers Leadframe conversion kits Multi die and multi pass bonding Point to Line Pick & Place Uniform gas flow Accurate and flexible temperature profile settings Highest throughput with matrix leadframes Individually programmable pick and bond force Lowest gas consumption Single wafer loader Manual QC inspection Productivity / Process...