X Becomes Z The High-Zpeed Solution on Die Bonder 2100

Achieving Die Bonding Quality at Unreached Throughput on Esec’s Die Bonder 2100 As one of the leaders in die attach for more than two decades, Esec is committed to surpassing its customers’ needs by constantly setting new industry standards in die attach. With its latest die attach platform, the revolutionary Die Bonder 2100, Esec demonstrates time and time again its innovation strength. As the first in the industry, Esec introduces the Z-Pattern© for small die bonding in the range of 0.8-1.5 mm, achieving unbeatable UPH rates. The new process combines the strengths of both, the process quality...

Cross Pattern Print/Write time Tail breaking time Dispense Process time Rating Production speed Tailing Epoxy symmetry Epoxy coverage & fillet © Patent pending. Copyright by Esec Ltd., 2010. All rights reserved.

To the limits. And beyond. Shaping Future Trends in Assembly and Packaging Esec has unique and extraordinary capabilities in the field of assembly and packaging. We continue to be the trend-setter in technology and in support of future advancements. And we will keep contributing to the positive development of the industry. This is where we differentiate ourselves and drive future growth. Our customers benefit from economical advantages provid­ d by our unique e technology and innovation concepts that are incorporated into our highly competitive products. Driving Innovation Strength As technology...