DATA SHEET MAY 2010 Sort to Tape Reel at up to 16,500 UPH Tape Reel Sorter CS 1250 • Pick, flip and place devices from wafer to tape reel with 4 point vision inspection process • Capable of handling devices from 0.3mm up to 10mm • Wafers up to 300mm diameter • Placement accuracy of ± 37µm @ 3 sigma • Post tape seal inspection • Tape width 8mm to 24mm • Placement accuracy of ± 37µm @ 3 sigma • Touch screen user interface • Real time wafer map display • Pressure sensitive (PSA) or heat activated (HAA) cover tapes • Automatic reject die management © copyright by Datacon

DATA SHEET MAY 2010 © copyright by Datacon Tape Reel Sorter CS 1250 Technical Specifications 79“ [1995mm] 31“ [779mm] 65“ [1651mm] Typical Throughput 0.3mm – 1mm = 12,000 UPH* 1mm – 2mm = 16,500 UPH* 2mm- 4mm =14,000 UPH* 4mm - 6mm = 12,600 UPH* 6mm – 10mm = 10,500 UPH* Placement Accuracy ± 37µm @ 3 sigma ± 1 degree theta Die Size 0.3mm – 3.5mm with small die optics 1mm – 10mm with standard optics Auto zoom Cassette Input 25 slot, 300mm (Semi G77) 25 slot, 3/16 pitch for 200mm and 150mm frames Inspection At Wafer and Handoff QFN and DFN Bond Pad Inspection - Size, shape, position, pitch BGA and...