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BE Semiconductor Industries N.V.
Datacon Tape Reel Sorter CS 1250

Datacon Tape Reel Sorter CS 1250

Product catalog summary

Overview: The Tape Reel Sorter CS 1250 is designed for sorting devices from wafers to tape reels with a high throughput of up to 16,500 units per hour (UPH). It features a 4-point vision inspection process and can handle devices ranging from 0.3mm to 10mm in size, with wafers up to 300mm in diameter.

Specifications:

Placement accuracy: ±37µm at 3 sigma, ±1 degree theta.
Die size capability: 0.3mm to 3.5mm with small die optics, 1mm to 10mm with standard optics.
Tape width: 8mm to 24mm.
Inspection capabilities include QFN and DFN bond pad inspection, BGA and bump inspection, ink dot, die size, X, Y, θ, edge chip, saw cut offset, laser mark, and pin 1 position.
Post seal inspection options include die flat in pocket and cover tape position.

Performance:

Typical throughput varies by device size: 12,000 UPH for 0.3mm–1mm, 16,500 UPH for 1mm–2mm, 14,000 UPH for 2mm–4mm, 12,600 UPH for 4mm–6mm, and 10,500 UPH for 6mm–10mm.

Features:

Touch screen user interface with real-time wafer map display.
Automatic reject die management.
Pressure sensitive (PSA) or heat activated (HAA) cover tapes.
Network connectivity via Ethernet or SECS, TCP/IC.

Physical and Operational Details:

Footprint: 1651mm x 1379mm.
Weight: 1451 kg (3200 lbs).
Power requirements: 200-240VAC, 1 PHASE 5.0KVA, 50-60Hz.
Air requirements: 5.9 to 7 bars, 600 LPM filtered and dried, 300 LPM quiescent.

Contact Information: Datacon Technology GmbH, Innstrasse 16, 6240 Radfeld, Austria. Phone: +43 5337 6000, Fax: +43 5337 600 66, Email: [email protected], Website: www.datacon.at

Catalog excerpts

DATA SHEET MAY 2010 Sort to Tape Reel at up to 16,500 UPH Tape Reel Sorter CS 1250 • Pick, flip and place devices from wafer to tape reel with 4 point vision inspection process • Capable of handling devices from 0.3mm up to 10mm • Wafers up to 300mm diameter • Placement accuracy of ± 37µm @ 3 sigma • Post tape seal inspection • Tape width 8mm to 24mm • Placement accuracy of ± 37µm @ 3 sigma • Touch screen user interface • Real time wafer map display • Pressure sensitive (PSA) or heat activated (HAA) cover tapes • Automatic reject die management © copyright by Datacon

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DATA SHEET MAY 2010 © copyright by Datacon Tape Reel Sorter CS 1250 Technical Specifications 79“ [1995mm] 31“ [779mm] 65“ [1651mm] Typical Throughput 0.3mm – 1mm = 12,000 UPH* 1mm – 2mm = 16,500 UPH* 2mm- 4mm =14,000 UPH* 4mm - 6mm = 12,600 UPH* 6mm – 10mm = 10,500 UPH* Placement Accuracy ± 37µm @ 3 sigma ± 1 degree theta Die Size 0.3mm – 3.5mm with small die optics 1mm – 10mm with standard optics Auto zoom Cassette Input 25 slot, 300mm (Semi G77) 25 slot, 3/16 pitch for 200mm and 150mm frames Inspection At Wafer and Handoff QFN and DFN Bond Pad Inspection - Size, shape, position, pitch BGA and...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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