Datacon DS9000e Future Proof Equipment The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak®. The DS9000e offers the ultimate combination of performance, flexibility, and versatility, handling the most challenging die sorting applications. •• Fully automatic wafer loading and vision alignment •• ±35 µm @ 3 sigma placement accuracy •• Small die and thin die handling •• Die inspection prior to pick and after placement Performance, Versatility and Flexibility Wafer to Frame Sorting up to 14,500 UPH Die sorting solution MAP SORTING ELECTRONIC WAFER MAP SORTING DUAL PICK&PLACE VISION ALIGNMENT DUAL PICK & PLACE AUTOMATIC VISION WAFER HANDLING CLEAN ROOM FLEXIBLE WAFER HANDLING CLEANROOM ENCLOSURE

DUAL PICK&PLACE WAFER HANDLING Dual Pick & Place •• Parallel processing for high throughput up to 14,500 UPH •• Adjustable force with synchronized die eject and pick •• Precise force control of GaAs, GaN, Si, and thin die •• High Placement accuracy of ±35 µm @ 3 sigma •• Handles a broad range of form factors - Bare die to LED Packages Flexible Wafer Handling •• 300 mm diameter wafers and smaller •• Film frame, expander grip ring •• Waffle pack, Gel‑Pak® and JEDEC tray carriers •• Automated wafer loading and unloading from cassette Electronic Wafer Map Sorting •• Sort known good die by bin grade...