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Datacon 8800 TC advanced

Product catalog summary

Overview
The document provides a detailed overview of the Datacon 8800 series, focusing on advanced packaging technologies and equipment capabilities. It highlights the ultra-fine pitch capability, enhanced thermo compression bond control, and the 7-axis bond head, emphasizing the equipment's productivity and compact footprint.

Datacon 8800 TC Advanced
This section discusses the Datacon 8800 TC advanced, which is pivotal for 2.5D/3D C2S and C2W packaging. It is noted for its advanced hardware architecture, process capabilities, and production stability. Key features include:

Ultra-fine pitch capability with high accuracy (2µm @ 3s).
Advanced process control and vision tools.
Tool-to-tool repeatability and optimized tool design.

Datacon 8800 CHAMEO Advanced
The Datacon 8800 CHAMEO advanced is tailored for Wafer-Level Fan-Out Packaging (WL-FOP), offering:

Extra speed (+40%) and enhanced accuracy (5 µm / 3 µm @ 3s).
Support for both face-down and face-up package designs.
ISO 5 clean class environment and FOUP load port.

Technological Features
The document outlines several technological advancements:

Advanced TC-CUF yield control and trajectory-controlled heating and cooling.
New thermal stress-resistant tool holder and accurate temperature calibration.
Next-generation control platform with enhanced motion control and reduced latency.
Integrated monitoring and alarming system with SECS/GEM compatibility.

7-Axis Bond Head
The 7-axis bond head includes:

3 actuators for positioning (X, Y, Theta).
2 axes for bond control (Z, W).
2 actuators for auto tilt setup (A, B).

Comparison of Models
The document compares the Datacon 8800 FC QUANTUM advanced, CHAMEO advanced, and TC advanced models, highlighting differences in local and global accuracy, vision systems, and other specifications such as UPH rates, clean class, and lead times.

Catalog excerpts

Datacon 8800 TC advanced advanced Datacon 8800 CHAMEO Advanced capabilities at smallest footprint Future Proof Equipment Future Proof Equipment capabilities and unsurpassed production stability. With its The Datacon complete new Advanced Hardware architecture, unique and 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for the unique 7-Axis Bond head and Advanced Process capabilities,chip attach of any FO-WLP packaging process, of reference of current Datacon 8800 TC advanced is the essential tool supporting both facedown (flip mode) TSV applications. and face-up (non flip mode) package designs. • Extra Speed +40% • enhanced accuracy 5 μm • Ultra Fine Pitch Capability / 3 μm @ 3s • Enhanced Thermo Compression Bond Control • 300 mm / 340 mm FO-WLP Carrier • 7-Axis Bond Head • Face-down & face-up (recipe-controlled) • Highest Productivity on Smallestport, Tape & Reel • Clean class ISO 5, FOUP load Footprint HIGH EXTRA ACCURACY SPEED ADVANCED PROCESS Highlights Highlights Thermo Compression bonding is the key technology for current Highest Productivity for with TC-CUF 2.5D/3D C2S and C2W packaging,FO-WLP as the currently established process for 3D memory, HPC and mobile applications. As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is advanced sets the new benchmark based on The Datacon 8800 TC a cost effective solution to adress increasing demands for performance, with total and warpage control. the proven 8800 concept form factor,process control, advanced ADVANCED ACCURACY FACE UP/DOWN OPTIMIZED TOOL DUAL PICK & PLACE UL STANDARD ADVANCED OPTIONS ADVANCED VISION TOOL 2 TOOL REPEATABILITY HIGHEST

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www.besi.com - [email protected] 1s Tool 2 Tool repeatability Next generation control platform • Advanced TC-CUF Yield Control • Yield and down-time prevention caused by flux • Trajectory controlled heating and cooling • New thermal stress resistant tool holder - Tilt • Accurate temperature calibration station • New motion control - New hardware & software • Enhanced trajectory control - Reduced latency times • More computing power - Process variable tracing Integrated Monitoring & Alarming • Alarm window setup for any process variable • Process variable monitoring against defined alarm window •...

Open the catalog to page 2

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