Datacon 8800 TC advanced advanced Datacon 8800 CHAMEO Advanced capabilities at smallest footprint Future Proof Equipment Future Proof Equipment capabilities and unsurpassed production stability. With its The Datacon complete new Advanced Hardware architecture, unique and 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for the unique 7-Axis Bond head and Advanced Process capabilities,chip attach of any FO-WLP packaging process, of reference of current Datacon 8800 TC advanced is the essential tool supporting both facedown (flip mode) TSV applications. and face-up (non flip mode) package designs. • Extra Speed +40% • enhanced accuracy 5 μm • Ultra Fine Pitch Capability / 3 μm @ 3s • Enhanced Thermo Compression Bond Control • 300 mm / 340 mm FO-WLP Carrier • 7-Axis Bond Head • Face-down & face-up (recipe-controlled) • Highest Productivity on Smallestport, Tape & Reel • Clean class ISO 5, FOUP load Footprint HIGH EXTRA ACCURACY SPEED ADVANCED PROCESS Highlights Highlights Thermo Compression bonding is the key technology for current Highest Productivity for with TC-CUF 2.5D/3D C2S and C2W packaging,FO-WLP as the currently established process for 3D memory, HPC and mobile applications. As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is advanced sets the new benchmark based on The Datacon 8800 TC a cost effective solution to adress increasing demands for performance, with total and warpage control. the proven 8800 concept form factor,process control, advanced ADVANCED ACCURACY FACE UP/DOWN OPTIMIZED TOOL DUAL PICK & PLACE UL STANDARD ADVANCED OPTIONS ADVANCED VISION TOOL 2 TOOL REPEATABILITY HIGHEST

www.besi.com - [email protected] 1s Tool 2 Tool repeatability Next generation control platform • Advanced TC-CUF Yield Control • Yield and down-time prevention caused by flux • Trajectory controlled heating and cooling • New thermal stress resistant tool holder - Tilt • Accurate temperature calibration station • New motion control - New hardware & software • Enhanced trajectory control - Reduced latency times • More computing power - Process variable tracing Integrated Monitoring & Alarming • Alarm window setup for any process variable • Process variable monitoring against defined alarm window •...