Datacon 8800 CHAMEO Highest Productivity for FO-WLP Future Proof Equipment As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to adress increasing demands for performance, form factor, and warpage control. The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any FO-WLP packaging process, supporting both facedown (flip mode) and face-up (non flip mode) package designs. • Extra Speed +40% • enhanced accuracy 5 μm / 3 μm @ 3s • 300 mm / 340 mm FO-WLP Carrier • Face-down & face-up (recipe-controlled) • Clean class ISO 5, FOUP load port, Tape & Reel EXTRA SPEED ADVANCED ACCURACY FACE UP/DOWN DUAL PICK & PLACE ADVANCED OPTIONS HIGHEST RELIABILITY

www.besi.com - [email protected] Extra Speed +40% - Improved CoO • Based on 4 Mpix 6 x 6 mm FOV cameras • Based on improved vision hardware & software • Based on optimized movements • 5 pm @ 3s global accuracy • 3 pm @ 3s local accuracy • APO Automatic Placement Optimization • Clean class ISO 5 (US class 100) • FOUP load port • Tape & Reel handling Face-up / Face-Down • NEW Face-up option from wafer and / or T&R • Recipe controlled, quick change-over • Multi chip capability