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BE Semiconductor Industries N.V.
Datacon 8800 CHAMEOadvanced

Datacon 8800 CHAMEOadvanced

Product catalog summary

Overview
The Datacon 8800 CHAMEOadvanced is a cutting-edge bonder designed for Wafer-Level Fan-Out Packaging (WL-FOP), offering a cost-effective solution to meet the growing demands for performance, form factor, and warpage control. It supports both face-down and face-up package designs, making it versatile for various packaging processes.

Key Features

Future Proof Equipment: Offers a 40% increase in speed, enhanced accuracy of 5 μm globally and 3 μm locally at 3s, and supports 300 mm / 340 mm FO-WLP carriers.
Face-up / Face-Down Capability: Includes a new face-up option with recipe-controlled quick change-over and multi-chip capability.
Advanced Accuracy: Features Automatic Placement Optimization (APO) for precise chip placement.
New Process Options: Includes clean class ISO 5, FOUP load port, and Tape & Reel handling.

Performance Comparison
The Datacon 8800 CHAMEOadvanced offers superior local and global accuracy compared to its predecessors, with a 4 MPix vision system and a 6 x 6 mm field of view. It supports larger strips, boats, and panels up to 340 mm and offers enhanced standard capabilities with additional options.

Applications
This equipment is suitable for various sectors including consumer electronics, automotive, mobile computing, and more, providing flexibility and reliability in advanced packaging processes.

Catalog excerpts

Datacon 8800 CHAMEO Highest Productivity for FO-WLP Future Proof Equipment As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to adress increasing demands for performance, form factor, and warpage control. The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any FO-WLP packaging process, supporting both facedown (flip mode) and face-up (non flip mode) package designs. • Extra Speed +40% • enhanced accuracy 5 μm / 3 μm @ 3s • 300 mm / 340 mm FO-WLP Carrier • Face-down & face-up (recipe-controlled) • Clean class ISO 5, FOUP load port, Tape & Reel EXTRA SPEED ADVANCED ACCURACY FACE UP/DOWN DUAL PICK & PLACE ADVANCED OPTIONS HIGHEST RELIABILITY

Open the catalog to page 1

www.besi.com - [email protected] Extra Speed +40% - Improved CoO • Based on 4 Mpix 6 x 6 mm FOV cameras • Based on improved vision hardware & software • Based on optimized movements • 5 pm @ 3s global accuracy • 3 pm @ 3s local accuracy • APO Automatic Placement Optimization • Clean class ISO 5 (US class 100) • FOUP load port • Tape & Reel handling Face-up / Face-Down • NEW Face-up option from wafer and / or T&R • Recipe controlled, quick change-over • Multi chip capability

Open the catalog to page 2

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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