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Datacon 2200 evoplus

Datacon 2200 evoplus
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Datacon 2200 evoplus Innovative Solution for Innovative Products Future Proof Equipment s The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Features Multi-Chip Capability Flexibility for Customizing Open Platform Architecture Enhancements PLUS Accuracy PLUS Productivity PLUS Flexibility Datacon 2200 evo goes PLUS! INTEGRATED DISPENSER FOIL MOLDING VISION ALIGNMENT PICK&PLACE PICK & PLACE HEAD

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www.besi.com - sales@besi.com Integrated Dispenser Vision Alignment Pressure/time (Musashi®), Auger, Jetter types available Epoxy stamping option Filled and unfilled epoxy, wide viscosity range Small footprint, low cost-of-ownership New high-speed image processing unit Full alignment & Bad mark search Pre-defined fiducial geometry & customized teaching Automatic Wafer and Tool Changer Fully Automatic cycle for Multi-Chip production Up to 7 Pick & Place tools (optionally 14), 5 eject tools Stamping tools and calibration tools possible Pick & Place Head Die Attach, Flip Chip and Multi-Chip in...

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