Innovative Solution for Innovative Products The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Datacon 2200 evo goes PLUS!Features • Multi-Chip Capability ■ Open Platform Architecture 8 WEEKS LEAD TIME • PLUS Accuracy • PLUS Productivity ■ PLUS Flexibility

www.besi.com - [email protected] Multi-Chip ■ Fully automatic cycle for Multi-Chip production ■ Up to 7 Pick & Place tools (optionally 14), 5 eject tools ■ Pressure/time (Musashi®), Auger, Jetter type dispensers available ■ Epoxy stamping option ■ Filled and unfilled epoxy, wide viscosity range New high-speed image processing unit Full alignment & Bad mark search Pre-defined fiducial geometry & customized teaching Pick & Place Head■ Die Attach, Flip Chip and Multi-Chip in one machine ■ Die pick from: wafer, waffle pack, Gel-Pak®, feeder • Die place to: substrate, boat, carrier, PCB, leadframe, wafer...