Datacon 2200 evo Innovative Solution for Innovative Products The Datacon 2200 evo die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for high bonding accuracy and lower cost of ownership. Future Proof Equipment Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers high accuracy with long-term stability using a new camera system, higher speed through a new image processing unit, and improved cleanroom capabilities. Datacon 2200 evo Enhancements • Accuracy • Productivity • Flexibility Features • Multi-Chip Capability • Flexibility for Customizing • Open Platform Architecture 8 WEEKS LEAD TIME TOOL-TO-TOOL REPEATABILITY ACCURACY FLEXIBILITY MULTI-CHIP

www.besi.com - [email protected] Multi-Chip • FuLLy automatic cycle for Multi-Chip production • Up to 7 Pick & Place tools (optionally 14), 5 eject tools • Pressure/time (Musashi®), Auger, Jetter type dispensers available • Epoxy stamping option • Filled and unfilled epoxy, wide viscosity range New high-speed image processing unit FuLL aLignment & Bad mark search Pre-defined fiduciaL geometry & customized te. Pick & Place Head • Die Attach, Flip Chip and Multi-Chip in one machine • Die pick from: wafer, waffle pack, GeL-Pak®, feeder • Die place to: substrate, boat, carrier, PCB, Leadframe, wafer...