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Datacon 2200 evo

Product catalog summary

Overview
The Datacon 2200 evo is a die bonder designed for Multi Module Attach, offering high bonding accuracy and reduced cost of ownership. It is built on a proven platform with enhancements for flexibility, customization, and cleanroom capabilities.

Key Enhancements

Accuracy: Improved with a new camera system and high-speed image processing unit.
Productivity: Enhanced through faster processing capabilities.
Flexibility: Offers full customization possibilities and multi-chip capability.

Features

Multi-Chip Capability: Supports fully automatic cycles for multi-chip production with up to 7 Pick & Place tools, optionally 14, and 5 eject tools.
Open Platform Architecture: Allows for extensive customization.
Tool-to-Tool Repeatability: Ensures consistent performance across tools.

Performance Specifications

Placement Accuracy: X/Y accuracy of ± 10 µm and Theta accuracy of ± 0.15°.
Bond Heads: Standard bond head with 0° - 360° rotation and optional heated bond head.
Alignment: Features full alignment and bad mark search with pre-defined fiducial geometry.

Pick & Place Head

Supports Die Attach, Flip Chip, and Multi-Chip processes.
Compatible with various die sources and placement targets.
Supports hot and cold processes including epoxy, soldering, and thermo-compression.

Physical Specifications

Footprint: Dimensions are 1160 mm x 1225 mm x 1750 mm.
Uptime: Greater than 98%.
Yield: Greater than 99.95%.

Wafer and Chip Tray Specifications

Die Size: 0.17 mm - 30 mm for die attach.
Die Thickness: 0.17 mm - 50 mm.
Wafer Size: 2” - 12” (50 mm - 300 mm).
Chip Trays: Supports waffle pack, Gel-Pak®, and JEDEC trays on request.
Substrate Working Range: 13” x 8” (325 mm x 200 mm).

Catalog excerpts

Datacon 2200 evo Innovative Solution for Innovative Products The Datacon 2200 evo die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for high bonding accuracy and lower cost of ownership. Future Proof Equipment Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers high accuracy with long-term stability using a new camera system, higher speed through a new image processing unit, and improved cleanroom capabilities. Datacon 2200 evo Enhancements • Accuracy • Productivity • Flexibility Features • Multi-Chip Capability • Flexibility for Customizing • Open Platform Architecture 8 WEEKS LEAD TIME TOOL-TO-TOOL REPEATABILITY ACCURACY FLEXIBILITY MULTI-CHIP

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www.besi.com - [email protected] Multi-Chip • FuLLy automatic cycle for Multi-Chip production • Up to 7 Pick & Place tools (optionally 14), 5 eject tools • Pressure/time (Musashi®), Auger, Jetter type dispensers available • Epoxy stamping option • Filled and unfilled epoxy, wide viscosity range New high-speed image processing unit FuLL aLignment & Bad mark search Pre-defined fiduciaL geometry & customized te. Pick & Place Head • Die Attach, Flip Chip and Multi-Chip in one machine • Die pick from: wafer, waffle pack, GeL-Pak®, feeder • Die place to: substrate, boat, carrier, PCB, Leadframe, wafer...

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Datacon 2200 evo

Datacon 2200 evo

Catalog excerpts

All BE Semiconductor Industries N.V. catalogs and technical brochures

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