Datacon 2200 evo hS Innovative Solution for Innovative Products Future Proof Equipment The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Image Sensor Hard Drive 8 WEEKS LEAD TIME Features • Multi-Chip Capability • Flexibility for Customizing • Open Platform Architecture Enhancements • PLUS Accuracy • PLUS Productivity • PLUS Flexibility • PLUS UPH TOOL-TO-TOOL REPEATABILITY ACCURACY FLEXIBILITY MULTI-CHIP

www.besi.com - [email protected] Multi-Chip • FuLLy automatic cycle for Multi-Chip production • Up to 7 Pick & Place tools (optionally 14), 5 eject tools • Pressure/time (Musashi®), Auger, Jetter type dispensers available • Epoxy stamping option • Filled and unfilled epoxy, wide viscosity rangeAccuracy New high-speed image processing unit Full alignment & Bad mark search Pre-defined fiducial geometry & customized teaching Mass curing Epoxy application Pick & Place Head • Die Attach, Flip Chip and Multi-Chip in one machine • Die pick from: wafer, waffle pack, GeL-Pak®, feeder • Die place to: substrate,...