9800 TC next
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Catalog excerpts

9800 TC next Next-gen die attach for chiplet & interposer packages The 9800 TC next is the latest innovation in thermo compression bonding, designed to meet the evolving trends and stringent requirements of advanced packaging. Engineered for excellence, this system features significantly enhanced key performance indicators, ensuring superior results in every application. Future Proof Equipment Key Highlights • Advanced Micro-Inert Chamber: Optimized for minimal gas consumption, this critical assembly ensures efficient operation and cost savings. • Unmatched Accuracy and Stability: Achieve precise bonding with long-term stability, perfect for advancing bump pitch scaling plans. • Powerful Bonding Capabilities: The 9800 TC next delivers bonding forces up to 500 N, with an optional upgrade to 1 kN, accommodating a variety of bonding needs. • High-Resolution Vision Systems: Ensures precise alignment and inspection, crucial for maintaining high quality standards. • Thin Die Capability: Expertly handles thin dies, expanding your application possibilities. • Superior Process Control: Advanced monitoring functions provide unparalleled control over the bonding process. • Configurable Material Feeding System: Offers incredible flexibility, allowing for customized material handling to suit diverse requirements. The 9800 TC next supports a wide range of applications, providing the versatility and performance you need to stay ahead in the rapidly evolving landscape of advanced packaging. Discover the future of thermo compression bonding now, with the 9800 TC next.

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www.besi.com - sales@besi.com Material handling Substrate wafer (through EFEM) Up to 12” wafer from FOUP (3 x FOUP ports) & quarter panel (300 x 300 mm) Substrate wafer thickness Component supply Tray (Jedec) handling Automatic Tray handling via FOUP T&R cart capacity (roadmap) Wafer handling (roadmap) P&P from taped wafer, waffle pack, gel pack, etc. (up to 15" frames) via FOUP Thermal capabilities @35 mm heater size (70 mm heater size roadmap)** Substrate wafer temperature Bond head temperature Bond head heating rate Bond head cooling rate Bond head thermal control & uniformity static...

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