8800 FC QUANTUM
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To the limits. And beyond. Breaking New Ground since 1986 Since its early beginnings in 1986, Datacon has been breaking new ground in the IC manufacturing and packaging industry. Datacon’s main area of expertise is the development and production of high-precision assembly equipment for the microchip industry. Leading microelectronics companies worldwide, such as Bosch, Fairchild, Siemens, Philips, Infineon, ST Micro, Skyworks and Asian subcontractors like Amkor, ASE and STATSChipPAC are among Datacon’s customers. Using a highly adaptable platform concept with modular systems, Datacon’s product range offers a large degree of flexibility and modularity for the IC manufacturing industry. Datacon is one of the leading and most innovative providers of assembly equipment for the semiconductor industry and is ahead of the field when it comes to new technologies such as flip chip and RFID (non-contact data transmission). Offering dynamic, flexible concept strategies and latest technologies, Datacon is known in the die bonder market as a solution supplier and an essential research partner for the semiconductor industry worldwide. Serving the Semiconductor Industry ing and plating equipment, for both array connect and leadframe assembly processes. Our technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or “packages”, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. Our innovative systems offer customers high productivity and improved yields from defect-free devices at a low total-cost-of-ownership. Datacon has been part of the Dutch Besi group (BE Semiconductor Industries N.V.) since early 2005. Besi and its subsidiaries form a leading group of manufacturers of semiconductor die sorting, flip chip and multichip die bonding, wire bonding, packag- GLOBAL HEADQUARTERS YOUR GLOBAL NETWORK Besi South East Asia China Esec (Shanghai) Taiwan Meco Equipment BE Semiconductor Esec (Singapore) Pte. Ltd. Esec (Shanghai) Trading Co. Ltd. Besi Singapore Pte. Ltd. Engineers B.V. Industries N.V. 1, Science Park Road Trading Co. Ltd. Suite 316, Building 2, Taiwan Branch Marconilaan 2 Ratio 6 Singapore Science Park 2 East 2/F, No. 32 Bldg No. 8 KeXin Road 8F, 276 Minsheng Road 515 DR Drunen 6921 RW Duiven #03-10, Capricorn Building No. 76 Fu Te Dong San Road West Park of Chengdu Hsinchu 30043 The Netherlands The Netherlands Singapore 117528 Waigaoqiao Free Trade Zone Hightech Zone Taiwan Tel. +31 416 384 384 Tel. +31 26 319 45 00 Tel. + 65 6303 7000 Shanghai 200131 Chengdu 610731, Tel. +886 3 515 3488 Fax +31 416 384 300 Fax +31 26 319 45 50 Fax + 65 6873 1133 P. R. China Sichuan Province Fax +886 3 515 2253 Tel. +86 21 6093 0588 P. R. China Fax +86 21 6093 0577 Tel. +86 28 879 581 59 Europe Besi North America, Inc. Fax +86 28 879 581 59 Esec Ltd. 33 East Comstock Drive, Hinterbergstrasse 32 Suite 7 Meco Equipment Engineers (Far East) Pte. Ltd. Americas 40, Jalan Pemimpin #04-06A Esec (Shanghai) Tat Ann Building Trading Co. Ltd. Fico Tooling Leshan Co. Ltd. 6330 Cham Chandler, AZ 85225 Singapore 577185 1A0706, Singa Plaza Tower High Tech Zone Switzerland USA Tel. +65 6255 2722 8 Jin Ji Hu Road Leshan 614012, Sichuan Tel. + 41 41 749 5111 Tel. +1 480 497 6404 Fax +65 6255 6766 Industrial Park P. R. China Fax + 41 41 749 5440 Fax +1 480 497 9104 Suzhou 215021 Tel. +86 833 259 6385 Besi APac Sdn. Bhd. P. R. China Fax +86 833 259 6368 Datacon Technology GmbH Online 3 Jalan 26/7 Tel. +86 512 6767 1037 Innstrasse 16 sales@besi.com Section 26 Fax +86 512 6767 1022 South Korea 6240 Radfeld www.besi.com Besi Korea Ltd. Austria 40000 Shah Alam Selangor Darul Ehsan Esec (Shanghai) #1204 Downtown Building Tel. +43 5337 6000 Malaysia Trading Co. Ltd. 22-3 Sunae-dong Fax +43 5337 600 66 Tel. +603 5191 1719 Suite 801, Galaxy Center Bundang-gu, Sungnam-si, Fax +603 5192 9416 Building Gyeonggi-do Fico B.V. Caitian Road, Futian District Korea 463-825 Ratio 6 Shenzhen 518026 Tel. +82 31 718 9002 6921 RW Duiven Guangdong Province Fax +82 31 718 9003 The Netherlands P. R. China Tel. +31 26 319 6100 Tel. +86 755 8826 4058 Fax +31 26 319 6200 Fax +86 755 8826 4067

8800 FC Quantum The Reference in Flip Chip Bonding

Capability and Flexibility Innovation and flexibility … forward-looking concepts and strategies … a strong focus on the success of our customers – these are the keys to Datacon’s leading position in the flip chip packaging market. The Datacon 8800 flip chip platform provides all features needed to cope with the challenges of today’s flip chip production and the demands of tomorrow, while at the same time offering easy, hasslefree machine operation. From time to time in this young technology, sudden ‘technology shifts’ of existing products from wire bonding to flip chip technology occur,...