2200 evo plus Future Proof Equipment Innovative Solution for Innovative Products The 2200 evoplus die bonder for Advanced Packaging assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. LED Me Hard Drive d ic al Au iv ctro nic s e F li p ot n ch ti o ec Ele Image Sensor ip Dis p se Die a en to m Features • PLUS Accuracy • PLUS Productivity • PLUS Flexibility Insp Enhancements il e 2200 evo goes PLUS! Mob thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. SIP Hybrid ch tta Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and • Multi-Chip Capability • Flexibility for Customizing • Open Platform Architecture the future of Advanced packaging INTEGRATED INTEGRATED DISPENSER DISPENSER VISION VISION ALIGNMENT ALIGNMENT AUTOMATIC AUTOMATIC CHANGER CHANGER PICK & PLACE PICK&PLACE HEAD HEAD Datacon

INTEGRATED DISPENSER Integrated dispenser VISION ALIGNMENT Vision alignment •• Pressure/time (Musashi®), Auger, Jetter types available •• Epoxy stamping option •• Filled and unfilled epoxy, wide viscosity range •• Small footprint, low cost-of-ownership •• New High-speed image processing unit •• Full alignment & Bad mark search •• Pre-defined fiducial geometry + customized teaching AUTOMATIC CHANGER Automatic wafer and tool changer •• Fully Automatic cycle for Multi-Chip production •• Up to 7 (option: 14) Pick & Place tools, 5 eject tools •• Stamping tools and calibration tools possible PICK&PLACE...