Multichip Die Bonder 2200 evo The Future of Advanced Packaging Available Today

Innovative Solution for Innovative Products Current trends in electronics are leading to an ever greater variety of functions, which are often implemented with systems-in-a-package (SiP) for short innovation cycles at low cost. For this purpose, evolutionary manufacturing equipment assembles all kinds of technologies on a tried-and-tested platform with high precision, to produce highly integrated packages with optimized costs, small dimensions, and excellent performance features. Datacon’s 2200 evo will suit your laboratory development and high-volume production needs perfectly and will grow...

To the limits. And beyond. Breaking New Ground since 1986 Since its early beginnings in 1986, Datacon has been breaking new ground in the IC manufacturing and packaging industry. Datacon’s main area of expertise is the development and production of high-precision assembly equipment for the microchip industry. Leading microelectronics companies worldwide, such as Bosch, Fairchild, Siemens, Philips, Infineon, ST Micro, Skyworks and Asian subcontractors like Amkor, ASE and STATSChipPAC are among Datacon’s customers. Using a highly adaptable platform concept with modular systems, Datacon’s product...