Introduction
The Multichip Die Bonder 2200 evo by Datacon represents the future of advanced packaging, offering innovative solutions for electronics with systems-in-a-package (SiP) to achieve short innovation cycles at low cost. This equipment is designed for both laboratory development and high-volume production, adapting to evolving requirements.

Performance
The 2200 evo boasts a placement accuracy of ± 7µm @ 3 Sigma and a throughput of up to 7,000 chips per hour. It is versatile for various multichip applications, including hybrid, stacked die, SIP/CMOS, or thin dies.

Versatility
This system offers flexibility for die attach and flip chip applications, equipped with an integrated dispenser, SEMI-standard 12” wafer handling, and a pick-and-place tool changer. It can process up to 25 different wafers in one cycle with automatic feed, thanks to its modular design.

Features

• High accuracy and productivity with low cost-of-ownership.
• Multichip capability with single pass production for complex products.
• Support for hot and cold processes: epoxy, soldering, thermo-compression.
• Open platform architecture for full customization.

Company Background
Datacon, part of the Dutch Besi group since 2005, has been a leader in IC manufacturing and packaging since 1986. It specializes in high-precision assembly equipment for the microchip industry, serving major companies like Bosch, Siemens, and Philips.

Global Presence
Datacon and Besi have a global network with offices in South East Asia, China, South Korea, Taiwan, Europe, and the Americas, providing comprehensive support and services worldwide.

Contact Information
For more information, contact Besi at their global headquarters in the Netherlands or visit their website at www.besi.com.