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Model SE105

Product catalog summary

Overview: The SE105 is a flip-chip pressure sensor die developed by BCM Sensor Technologies, designed for absolute, gauge, or differential pressure measurements. It utilizes a piezoresistive working principle and is manufactured using a 6-inch silicon micromachining process.

Key Features:

Flip-chip silicon-on-silicon structure for enhanced durability in harsh environments.
Elimination of traditional wire bonding, allowing for easy surface mounting.
Non-signal-conditioning sensor die with a closed-bridge circuit and 4 solder pads for bridge adjustment and temperature compensation.
Excellent non-linearity performance up to 0.2% full scale (fs).

Applications:

Medical: Clinical devices and patient monitoring systems.
Automotive: Engine control and suspension adjustment systems.
Consumer Electronics: Barometers, altimeters, and diving watches.
Automation: Mass production of pressure sensors, switches, and controllers.

Technical Specifications:

Pressure ranges: 0~1, 0~7, 0~10, 0~12, 0~28, 0~36 bar.
Pressure reference: Absolute (standard), gauge (available on request).
Proof pressure: 300 bar (200 for 10 bar range).
Burst pressure: 500 bar (300 for 10 bar range).
Full scale output: 100±30 mV.
Operating temperature range: -40°C to +125°C.
Storage temperature range: -55°C to +150°C.

Ordering Information: The ordering code format is SE105-[pressure range]-[pressure reference]-[non-linearity]-[bridge type]-[package]. Options include:

Pressure ranges from 0~1 bar to 0~36 bar.
Pressure reference: Absolute (A) or Gauge (G).
Non-linearity: 0.2%fs or 0.25%fs.
Bridge type: Closed-bridge (CB) or Open-bridge (OB).
Package: 6" wafer on blue tape (Y), individual die in plastic package (X), or wafer not diced (Z).

Catalog excerpts

Model SE105 Flip-Chip Pressure Sensor Dies Features Description The model SE105 is a flip-chip pressure sensor die based on piezoresistive working principle. It is designed for the pressure measurements of absolute, gauge or differential reference. The sensor die is manufactured by the 6" silicon micromachining process. Thanks to the unique flip-chip silicon-onsilicon structure, comparing with the conventional sensor die structure, the SE105 features various superiority: suitable for more harsh environment (because its Wheatstone bridge circuitry cannot be approached by pressure medium), and simplified die bonding process (because the traditional wire bonding process is eliminated and the SE105 can be easily attached onto the circuit as a surface mounting device). As a non-signal-conditioning sensor die, the standard SE105 is available in an closed-bridge circuit with 4 solder pads for both bridge adjustment and temperature compensation. Before packing, each SE105 sensor die is individually tested and qualified to its specifications. 3 types of packaging are available as options to fit different marketing demands. suitable for harsh environment easy bonding excellent non-linearity up to: ±0.2%fs designed for absolute, gauge or differential pressure applications Applications medical: clinical devices and patient monitoring systems (e.g., dialysis instruments) automotive: engine control, and suspension adjustment system consumer: consumer electronics, barometers (or altimeters), and depth gauges (e.g., diving watches) automation: mass production of pressure sensors, pressure switches, and pressure controllers silicon membrane silicon constraint silicon constraint cross-section of absolute pressure sensor die cross-section of gauge pressure sensor die BCM SENSOR TECHNOLOGIES BVBA Industriepark Zone 4, Brechtsebaan 2 website: www.bcmsensor.com B-2900 Schoten - Antwerpen, BELGIUM email: [email protected]

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Model SE105 Flip-Chip Pressure Sensor Dies Wheatstone Bridge Circuit Diagram excitation+ open-bridge circuit diagram (available on request) closed-bridge circuit diagram (standard) Technical Data Parameters pressure ranges pressure reference absolute (standard), gauge (available on request) proof pressure burst pressure full scale output (fso) 5 (typical), or any voltage in the range of 1, ..., 10Vdc 1 (typical), or any current in the range of 0.2, ..., 2mA zero offset long-term stability bridge resistance storage temperature range operating temperature range temp. coeff. (TC) of bridge resistance...

Open the catalog to page 2

Flip-Chip Pressure Sensor Dies_SENSOR Ordering Information Examples of Ordering Code • standard sensor die: model-pressure range-pressure reference-NL-bridge type-package BCM SENSOR TECHNOLOGIES BVBA Industriepark Zone 4, Brechtsebaan 2 Tel.: +32-3-238 6469 website: www.bcmsensor.com B-2900 Schoten - Antwerpen, BELGIUM Fax: +32-3-238 4171 email: [email protected]

Open the catalog to page 3

Model SE105

Model SE105

Catalog excerpts

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