Sensor Dies for Pressure Application The model SE103 is designed for gauge (relative), absolute or sealed gauge pressure measurements. As a piezoresistive sensor die, the SE103 is based on micro-electromechanical systems (MEMS) technology. The die is available in a foot-print of either 3.45mm x 2.70mm or 2.45mm x 2.45mm, depending on the pressure range. Compared with the SE101, the SE103 has silicon-on-glass structure. Moreover, the SE103 has better linearity for precise pressure measurements. In addition, there is a metallic layer made from aluminum on the surface of the die, which can prevent the bridge resistors from electromagnetic Designed as an uncompensated sensor die, the SE103 is available in an open-bridge circuit with 5 solder pads for both adjustment and temperature compensation of zero offset. The SE103 sensor die can also have customized parameters, e.g. the die with a closed-bridge circuit of 4 solder pads, with a customized pressure range, with a sealed gauge cavity for gauge pressure measurements, or finished without glass constraint. Before packaging, each SE103 sensor die is tested and inspected. • gauge pressure ranges: 0.1 bar, 25bar • absolute/sealed gauge pressure ranges: 1bar, 1000bar • high reliability and stability • suitable for either constant voltage or current excitation • metrology applications • process control systems • pneumatic and hydraulic systems • biomedical instruments Wheatstone Bridge Circuit Diagrams excitation* excitation* excitation- excitation- open-bridge circuit diagram closed-bridge circuit diagram (standard) (available as an option) BCM SENSOR TECHNOLOGIES BVBA Industriepark Zone 4, Brechtsebaan 2 Tel.: +32-3-238 6469 website: www.bcmsensor.com B-2900 Schoten - Antwerpen, BELGIUM Fax: +32-3-238 4171 email: sales@bcmsensor.

Model SE103 Sensor Dies for Pressure Application terminal pads layout for rated pressure ≥ 40bar terminal pads layout for rated pressure ≤ 25bar silicon membrane silicon membrane vacuum or sealed gauge cavity pressure cavity glass constraint glass constraint cross-section glass constraint with vent for gauge and differential pressure measurements (standard) cross-section glass constraint without vent for absolute and sealed gauge pressure measurements (standard) silicon membrane cross-section no glass constraint for gauge and differential pressure measurements (available as an option) Note: -...

Model SE103 Sensor Dies for Pressure Application Technical Data Parameters absolute/sealed gauge pressure ranges proof pressure burst pressure full scale output ZERO offset short term stability long term stability bridge resistance storage temperature range operating temperature range temp. coeff. (TC) of bridge resistance TC of zero offset TC of SPAN voltage excitation current excitation thermal HY of zero offset PN junction break down voltage with glass constraint without glass constraint General conditions for measurements: temperature = 25°C, humidity = 40%RH. Notes: 1. For customized pressure...

Model SE103 Sensor Dies for Pressure Application Ordering Information ordering code: SE103-60-A-II-OB-G8-X-(*) pressure type A = absolute customized range available as an option bridge type OB = open-bridge circuit (standard) CB = close bridge circuit die structure G8 = with glass constraint of 0.8mm thickness N = without glass constraint (available as an option for gauge or differential pressure type) package X = individual dice in 2" plastic package (standard) Y = 4" diced wafers on blue tape Z = 4" non-diced wafers on blue tape “(*)” is necessary only if any customized parameter is required,...