FD101

FD101

FD101

Product catalog summary
Overview: The document provides detailed information about the Model FD101, a piezoresistive force sensor die developed by BCM Sensor Technologies. It is designed for multi-axial force measurement and is suitable for applications requiring the measurement of extremely low-level forces.
Specifications: The FD101 sensor die is made from monocrystalline silicon and manufactured using MEMS technology, resulting in a compact size of 1.3mm x 1.3mm. It features a full-bridge circuit with four piezoresistive resistors, offering high sensitivity for low-level force measurement. The sensor die can measure forces in all directions and has a high output sensitivity of 25mV/V with excellent non-linearity up to 0.5% full scale.
Technical Data: The sensor operates with a Wheatstone bridge circuit configured to an open-bridge circuit with 5 solder pads, facilitating zero-offset adjustment and temperature compensation. The sensor's performance parameters include a strain range up to 500µɛ, a maximum working strain of 200µɛ, and a strain limit of 400µɛ. It operates within a temperature range of -55°C to +75°C.
Applications: The FD101 is suitable for various applications, including automation (mass production of force sensors, switches, and controllers), medical devices (such as dialysis instruments), stress analysis, and consumer electronics.
Packaging Options: The sensor die can be packaged in three different methods (X, Y, and Z) to meet different application demands. Each sensor die is individually tested and qualified before packaging.
Ordering Information: The document provides a detailed ordering code structure for the FD101, specifying parameters such as nominal strain, output signal, non-linearity, bridge type, package, and solder-pad finishing. Custom specifications can be included if required.
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Catalog excerpts

FD101-1

Description Dimensions Model FD101 is a piezoresistive force sensor die, which is made from monocrystalline silicon and specially designed for multi-axial force measurement or sensor application to measure extreme low-level forces. It is manufactured through MEMS process and therefore features small size (1.3mm x 1.3mm) and capacity of high volume per batch in mass production. This model FD101 force sensor die has its four piezoresistive resistors each laid perpendicularly to the adjacent ones, similar pattern to the EB-type of metal foil strain gauges from BCM SENSOR. As a result, this force sensor die can be used to measure a force in all directions. The four piezoresistive resistors of the FD101 force sensor die constitute a full-bridge circuit, resulting in a high sensitivity for low-level force measurement down to a few microstrains. On the FD101, its Wheatstone bridge circuit is configured to the open-bridge circuit of 5 solder pads, on which gold leads can be attached on request. 5 solder pads also bring advantage to facilitation of its zero-offset adjustment and temperature compensation. As there is no signal-conditioning circuitry on this sensor die, its output signal is directly from its Wheatstone bridge circuit. Three different packaging methods (X, Y, and Z) can be used and are available to package the FD101 sensor dies in order to fit to different application demands. Before packing, each FD101 sensor die is individually tested and qualified to its specifications. Features • excellent non-linearity up to: ±0.5%fs • high output sensitivity: ^ 25mV/V • small foot-print, high product rate per wafer for cost-effective application • gold leads on solder pads available on request Applications • automation: mass production of force sensors, force switches, and force controllers • medical: clinical devices and patient monitoring systems (e.g. dialysis instruments) • stress analysis: stress, strain, and vibration monitoring • consumer: consumer electronics BCM SENSOR TECHNOLOGIES BVBA Industriepark Zone 4, Brechtsebaan 2 B-2900 Schoten - Antwerpen, BELGIUM website: www.bcmsensor.com email: [email protected]

 Open the catalog to page 1
FD101-2

SENSOR Wheatstone Bridge Circuit Diagram Technical Data Parameters General conditions for measurements: temperature = 25°C, humidity = 40%RH. Notes: 1. fs refers to full scale strain. 2. Measured at nominal strain of 500je with orientation laterally along any of the resistor of the sensor die. 4. Calculated according to Terminal Base Line (the endpoint method). 5. Calculated as a rate of resistance change between -55°C and +75°C, and normalized by the resistance at 25°C. 6. Calculated as a rate of output change between -55°C and +75°C, and normalized by the output at 25°C, when the die is not...

 Open the catalog to page 2
FD101-3

SENSOR Ordering Information Iposition (pos.) 1: model FD101 |pos. 2: nominal strain 500 = 500je pos. 3: output signal 125mV Ipos. 4: non-linearity 0.5%fs pos. 5: bridge type OB = open-bridge circuit pos. 6: package X = individually packaged die in plastic package (standard for sample order) Y = diced wafer on tape (standard for volume order) Z = non-diced wafer Examples of Ordering Code standard sensor die: FD101-500-125mV-0.5%fs-OB-Y The listed dimensions, specifications and ordering information are subject to change without prior notice. Industriepark Zone 4, Brechtsebaan 2 B-2900 Schoten -...

 Open the catalog to page 3

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