Gas flow rate control N2 flow rate control for chemical spray nozzle More uniform application of wafer cleaning chemicals! Product name Process sensor Digital mass flow controller MQV_ _ _ _ Current Situation Process and equipment name Front-end process, single wafer cleaning equipment Current Issues The nitrogen f low rate for chemical spray noz zles is controlled by adjusting the regulator pressure. Due to miniaturization, the chemical flow rate must be minutely adjusted for each type of product or process. Problem 1 When the relationship of pressure and flow rate changes due to clogging, etc., the amount of chemical changes, affecting the quality of cleaning. Problem 2 For existing regulators, it is difficult to make fine changes in settings from a control device. Chemical solution Chemical solution Nozzle

High-performance digital mass flow controller (model MQV_ _ _ _ ) Various ways to change the settings from a host device Ultra-fast micro-flow (μF) sensor, combined with advanced actuator control technology Because the flow rate is directly controlled, it is not affected by clogging or other factors, affording greater stability and better cleaning quality. With the MQV_ _ _ _, you can change the flow rate settings using an external input switch, analog signal, or RS-485 communication. Achieves both high speed control of 300ms and low differential pressure operation. Other features: freely selectable...