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Liquid temperature control

Liquid temperature control

Liquid temperature control

Product catalog summary
Introduction
This document discusses the use of Network Instrumentation Modules to enhance throughput and reduce the footprint in semiconductor cleaning processes. The focus is on improving temperature control in chemical solution processes to minimize startup time and overshoot.

Current Situation and Issues
The chemical solution used in SPM cleaning generates heat, causing a delay in temperature stabilization. The current system struggles with overshoot, leading to prolonged startup times. Additionally, the increase in temperature control points and monitoring points necessitates a reduction in controller footprint and wiring.

Solutions
  • Solution 1: High-speed Settling Logic
    The Just-FiTTER algorithm suppresses overshoot, allowing the setpoint (SP) to be reached in about 20 minutes, significantly faster than conventional PID control.
  • Solution 2: Compact Module Design
    A single module can manage PID control for four loops with four current transformer inputs, reducing the module footprint by half.
  • Solution 3: Ethernet Support
    Standard Ethernet support enables concatenated or distributed layouts, reducing communication wiring and saving space.

Technical Specifications
The Network Instrumentation Modules support various operations, including PID, event operations, pulse integration, and logical operations. They offer multiple input/output options and support Ethernet and serial communication.

Conclusion
The integration of Network Instrumentation Modules with the Just-FiTTER algorithm provides a more efficient and compact solution for temperature control in semiconductor cleaning processes, enhancing throughput and reducing the system footprint.
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Catalog excerpts

Liquid temperature control-1

Network Instrumentation Modules Network Instrumentation Modules Chemical solution temperature control With Network Instrumentation Modules, better throughput & smaller footprint! Product name Network Instrumentation Modules NX-_ _ _ Current Situation Process and equipment name Front-end process, single wafer cleaning equipment Current Issues The chemical solution used for SPM cleaning generates heat when blended, and the temperature takes a long time to stabilize in the chemical solution tank. Temperature is also adjusted in the piping to keep it consistent while the chemical solution is sent from the tank to the cleaning nozzle. To improve throughput, we need to suppress overshoot caused by the heat of reaction in order to reduce the startup time when replacing the chemical solution. Problem 2 Blending unit We have many cleaning chambers and need to minimize the controller footprint and the wiring work, even though the number of temperature control points in the piping and heater wire break monitoring points are increasing. Chemical tank

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Liquid temperature control-2

High-speed settling logic of the Just-FiTTER algorithm Four-channel current transformer input Standard Ethernet support allows for concatenated or distributed layout Azbil’s unique algorithm suppresses overshoot, allowing significantly faster equipment startup. A single module can supply PID control to four loops, and it is equipped with four current transformer inputs. The footprint of this compact module is just half that of the previous module. Concatenated layout using Ethernet reduces communication wiring. Linkage between modules Analog input Analog output Current transformer input Event...

 Open the catalog to page 2

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