10GbE XFP 850 nm 10Gbps Optical Transceiver
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The 850 nm XFP transceiver is a high performance, cost eective module for serial optical data communications applications specied for signal rates of 9.9 Gb/s to 10.5 Gb/s. It is compliant to XFP MSA Rev 4.5. The module is designed for multi mode ber and operates at a nominal wavelength of 850 nm. The transmitter section incorpo- rates Avago Technologies 850 nm Vertical Cavity Surface Emitting Laser (VCSEL). The receiver section uses Avago TechnologiesҒ MOVPE grown planar SEDET PIN photo- detector for low dark current and excellent responsivity. Integrated Tx and Rx signal conditioners provide high jitter-tolerance for full XFI compliance. The internally ac coupled high speed serial I/O simplies interfacing to external circuitry. The electrical interface is made using an industry standard 0.8 mm pitch 30-pin right angle connector. Optical connection is made via the duplex LC connector.The product also oers digital diagnostics using the 2-wire serial interface dened in the XFP MSA. The product provides real time temperature (module and laser), sup- ply voltage, laser bias current, laser average output power and received input power. The digital diagnostic interface also adds the ability to disable the transmitter (TX_DIS), power down the module, monitor for module faults and monitor for Receiver Loss of Signal (RX_LOS). Transmitter disable, interrupt, power down/reset, receiver loss of sig- nal and module not ready are also hard wired pins on the 30-pin right angle connector. RoHS 6/6 Compliance Օ ComplianttoXFPMSACompliant to XFP MSA Compliant to IEEE 802.3ae 10GBASE-SR for 10GbE, 10.3125 Gb/s Օ Compliant XFI 10G Serial electrical interface 3.3V single power supply Օ Avago Technologies 850 nm VCSEL Laser and PIN Photodiode ҕ No reference clock required LC Duplex optical connector interface conforming to ANSI TIA/EIA604-10 (FOCIS 10) Օ 1.5W maximum Link Lengths up to 300 m with 0M3 ber Օ 0 to +70 C case operating temperature range Е Superior Thermal and EMI integrity performance to sup-port high port densities Customizable clip-on heatsink to support a variety of line card environments Օ IEC 60825-1 Class 1/CDRH Class 1 laser eye safety > Fiber Channel Switches Օ Host Bus Adapter Cards Mass Storage System and Server I/O Օ Ethernet Switches Core Routers 1 >

Heat sink Analog bus LaserRFdriver SignalConditioner +3.3V CWdriver Mon. PIN Digital 10Gb/s electricalI/O EEPROM > Analogsignalconditioners Microcontroller Digital lowspeed bus or signal > Optical receptacles Powersupplycontrol A/D > Electrical connector PIN TIA TIA Analog signal ROSA TOSA SignalConditioner Main housing ESA >

Dierential Input ImpedanceZ > d 100 ѢĦ Termination Mismatch ∆ Z > M 5%Dierential Input AmplitudeDVQDO120820mVpeak to peak (1) Dierential Input Return Loss SDD1120dB0.05 to 0.1 GHz Dierential Input Return Loss SDD118dB0.1 to 5.5 GHzDierential Input Return Loss SDD118 - 20.66 log10(f/5.5) f in GHz dB5.5 - 12 GHzCommon Mode Input Return LossSCC113dB0.1 to 15 GHzDierential to Common Mode ConversionSCD1110dB0.1 to 15 GHzJitter and Eye MaskXFP MSA Compliant > Dierential Input ImpedanceZ > d 100 Ω Termination Mismatch ∆ Z > M 5%Dierential Output Amplitude340850mVpeak to peak (1) DC Common Mode...

Center wavelength (nm) 0.4 to 0.45 nm0.35 to 0.4 nm 0.3 to 0.35 nm 0.25 to 0.3 nm 0.2 to 0.25 nm 0.15 to 0.2 nm Up to 0.05 nm -2.5-2.7-2.9-3.1-3.3-3.5-3.7-3.9-4.1-4.3-4.5840 > Minimum transmit OMA (dBm) 845850855860 > Figure 4a. Triple tradeo curve for 10GBASE-S (informative)

ClipHost Board Heat Sink Cage Assembly Case TemperatureMeasurement Point > ModuleBezelEMI Gasket(not shown)Connector > Figure 5. XFP Assembly Drawing 10 >

The 2-wire serial interface is explicitly dened in the XFP MSA Rev 4.0. 2-wire timing specications and the struc- ture of the memory map are per XFP MSA Rev 2.0. The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for diagnos- tic information providing the opportunity for Predictive Failure Identication, Compliance Prediction, Fault Isola- tion and Component Monitoring. The upper address space tables are used for less frequently accessed func- tions such as serial ID, user writeable...

Figure 6a. Module Drawing Figure 6b. Module Drawing >

Figure 7. XFP host board mechanical layout 13 >

An Evaluation Kit and Reference Designs are available to assist in evaluation of the AFBR-720XPDZ. Please con- tact your local Field Sales representative for availability and ordering details. There are two conditions in which immunity to ESD damage is important. Table 13 documents the ESD im- munity to both of these conditions.The rst condition is static discharge to the transceiver during handling such as when the transceiver is inserted into the transceiver port. To protect the transceiver, it is important to use normal ESD handling precautions in- cluding the use of grounded wrist...

The transceivers have a shielded design to provide excel-lent immunity to radio-frequency electromagnetic elds which may be present in some operating environments. The AFBR-720XPDZ contains no user serviceable parts. Tampering with or modifying the performance of the AFBR-720XPDZ will result in voided product warranty. It may also result in improper operation of the AFBR- 720XPDZ circuitry, and possible overstress of the laser source. Device degradation or product failure may result. Connection of the AFBR-720XPDZ to a non-approved op- tical source, operating above the recommended absolute...