MAS 339 Pro
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flUTOTRONIK Fertigungssysteme fur die Elektronikindustrie AUTOTRONIK-SMT GmbH SulzbacherStr. Ill D-92224 Amberg Tel +49(0)9621-600691 Fax +49(0)9621-600692 office@autotronik-smt.com www.autotronik-smt.de • MAS339 Pro adopts high-strength steel frame and customized precision-grade marble structural parts, to ensure the accuracy and stability of the machine. • Vision system hardware adopts high-resolution digital camera and lens with the pixel size as fine as 5um. • The visual light source system has multiple sets of light source combinations at the same time, which corresponds to the visual inspection requirements of various wafer chips. • Visual recognition system: Operator can select Pattern matching + Edge matching as the recognition condition, to greatly improve the mounting accuracy and product stability. • System build-in Error Proofing function for vision recognition the unqualified, direction-error and BadMark components. • The mainly driving axis is adopts a high-resolution linear encoder and linear motors to constructs a fully closed-loop precise controlling system. • The bond head driver adopts closed-loop pressure controlling system, setting range: 30~500g. • Production capacity can reach to max. 2000 UPH. • Optional automatic loading/unloading system to avoided the operation error and labor cost reduced with production efficiency improved. • Optional Tray Feeder to integrated with Wafer/Tape feeding system to constructs a multi-form pick and place assembly platform, for the placement requirement of Dies, Chips and Solder-plate. • Machine's outer cover is made of shiny mirror surface stainless steel plate, and the dust-free level inside the equipment can reach Level '10'. • Component alignment system adopts UP alignment method for auto-offset, which can effectively prevent the nozzle being dirty due to excessive suction while the component position deviation. • Electrical control system adopts the international mainstream EtherCat scheme, with perfect diagnostic software, which makes the equipment maintenance be easier. • The Auto-wafer loading system can store up to 25 types of wafer dies, and available to programming the various PnP procedures as required. • The PC has a 240GB high-speed SSD hard disk, there is unlimited for production file storage. 8" / 12" Wafer Flange Platfo

Bulk-pack materials can be fully automatic identification and Pick & Place with the aid of automatic bulk material feeding platform (with vibration driver) and the advanced image recognition systems. MAS399 Pro is equipped with multiple sets of HD cameras, which are used for the high-definition recognition of the die & chips, the FOV range is 0.15*0.15 to 8*8 mm.

Tray feeding platform: Allowed 16 pcs. of 2" Gel-Pak / JEDEC material tray place on each group of tray feeding, and max. three groups are available install in a machine. Laser height measurement device Effective area of placement platform Effective area of wafer feeding platform Bonding force (standard range) Production capacity Placement accuracy Correspond to different components height on carrier 600mm x 500mm (resolution : 0.01pm) 220mm x 220mm (resolution : 0.01pm) 30g-500g (optional up to 2000g) 2000 dies/h (for standard application & material) ±10~20pm @ 3 sigma* (process depending)

MAS399 Pro Technical Parameters ITEMS XY Placement Accuracy XY Resolution R-axis Resolution Feeding Forms Tape Feeder Platform Wafer Platform (Option) Tray Platform (Option) Productivity Pressure Control of Bond head Glue Dispensing (Optional) Conveyor Through Conveyor System Board / Carrier size Transmission control Component (DIE) size Types of placement object Positioning Camera Object Positioning Method Operation System Power Supply Requirement Dimension (L*W*FI) Weight SPECIFICATIONS ± 10 ~ 20pm (process depending) 0.001mm 0.02° Tape Feeder (std.) + Tray (option) + Wafer (option)...