AT530

AT530

Product catalog summary
Specifications
  • High productivity with a capacity of over 5000 pieces per hour, facilitated by three simultaneous gel dispensing heads.
  • Real-time Bond Post Checking (BPC) ensures high reliability for continuous production.
  • Real-time Gel-trail Inspection to minimize wastage by ignoring failed dispenses.
  • User-friendly software control enhances operational efficiency.
Performance and Accuracy
  • Precision and high performance with X/Y repeatability accuracy of 0.015mm and R-axis accuracy of 0.2.
  • Highly accurate and stable placement with X & Y accuracy less than 15 micrometers and R accuracy of 0.2.
Automation Features
  • Auto-loading system for wafer flange load and unload from magazine, supporting up to 25 storeys.
Manufacturer Information
  • Produced by AUTOTRONIK-SMT GmbH, located at Sulzbacher Strasse 111, 92224 Amberg, Germany.
  • Contact: Tel: +49 (0) 9621-600 691, Fax: +49 (0) 9621-600 692.
Additional Notes
  • The manufacturer reserves the right to make changes without notice.
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Catalog excerpts

AT530-1

flUTOTROfllK Fertigungssysteme fur die Elektronikindustrie AT530 IR Filter High Speed Bonder ■ High productivity up to 5000 + pcs/hour ■ 3 Simultaneous Gel Dispense Heads ■ X/Y Repeatability Accuracy + 0.015mm ■ R-axis Accuracy +0.2° ■ Real-time Bond Post Checking (BPC) Specifications 3 Gel Dispensing Heads High speed as 5000+ pcs per hour achieved by 3 simultaneous Gel Dispensing Heads. ■ High Reliability for Continuous Production ■ Real-time Gel-trail Inspection ■ User Friendly Software Control Highly accurate and stable Auto-loading System Auto-loading system for the wafer flange load and unload from magazine, maximum up to 25 storeys. Real-time Gel-trail Inspection X & Y Placement Accuracy less than + 15um, R Accuracy as + 0.2° Real-Time Gel-Trail inspection to guarantee any failed dispense shall be ignored to reduce wastage. We reserve the right to make changes without notice ® flUTOTROfllK l J Fertigungssysteme fur die Elektronikindustrie

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