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AUTOTRONIK-SMT GmbH
Catalog excerpts
flUTOTROfllK Fertigungssysteme fur die Elektronikindustrie AT530 IR Filter High Speed Bonder ■ High productivity up to 5000 + pcs/hour ■ 3 Simultaneous Gel Dispense Heads ■ X/Y Repeatability Accuracy + 0.015mm ■ R-axis Accuracy +0.2° ■ Real-time Bond Post Checking (BPC) Specifications 3 Gel Dispensing Heads High speed as 5000+ pcs per hour achieved by 3 simultaneous Gel Dispensing Heads. ■ High Reliability for Continuous Production ■ Real-time Gel-trail Inspection ■ User Friendly Software Control Highly accurate and stable Auto-loading System Auto-loading system for the wafer flange load and unload from magazine, maximum up to 25 storeys. Real-time Gel-trail Inspection X & Y Placement Accuracy less than + 15um, R Accuracy as + 0.2° Real-Time Gel-Trail inspection to guarantee any failed dispense shall be ignored to reduce wastage. We reserve the right to make changes without notice ® flUTOTROfllK l J Fertigungssysteme fur die Elektronikindustrie
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