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AT97SC3205T I²C Interface TPM I²C interface datasheet summary. This is a summary document. The complete document is available under NDA. For more information, please contact your local Atmel sales office

AT97SC3205T I²C Interface TPM I²C interface datasheet summary. This is a summary document. The complete document is available under NDA. For more information, please contact your local Atmel sales office
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Trusted Platform Module SUMMARY DATASHEET • Compliant to the Trusted Computing Group (TCG) Trusted Platform Module • Single-chip Turnkey Solution • Hardware Asymmetric Crypto Engine • Atmel AVR® RISC Microprocessor • Internal EEPROM Storage for RSA Keys • 400kHz Fast Mode/100kHz Standard Mode l2C Operation • Secure Hardware and Firmware Design and Device Layout • FIPS-140-2 Module Certified Including the High-quality Random Number Generator (RNG), HMAC, AES, SHA, and RSA Engines • NV Storage Space for 2066 bytes of User Defined Data • 28-lead Thin TSSOP or 32-pad QFN Packages • Offered in Commercial (0°C to 70°C) and Industrial (-40 to +85°C) Temperature Range Atmel AT97SC3205T is a fully integrated security module designed to be integrated into embedded systems. It implements version 1.2 of the Trusted Computing Group (TCG) specification for Trusted Platform Modules (TPM). This is a summary document. available under NDA. For more information, please contact your local Atmel sales office.

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Pin Configuration and Pinouts Table 1-1. Reset Input Active Low Serial Data Input/Output Serial Clock Input General Purpose Input/Output Hardware Physical Presence or GPIO Pin Test Input (Disabled) Test Input (Disabled) / XTAMPER / GPIO Pin Low-Power Sleep Recovery (Active Low) Pinout Diagrams * Used for Atmel internal testing only. Tie to VCC or GND directly or through a 4.7K resistor. SM_DAT SM_CLK 28-pin TSSOP 4.40mm x 9.70mm Body 0.65mm Pitch

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SPI Interrupt Requests. If unused, this pin should be tied to ground directly or through a 4.7K resistor. Atmel Test Pins. Only utilized during manufacturing test. To optimize power savings and improve noise immunity, these ATest pins should be biased to VCC or GND as follows: TSSOP Pin 21 / QFN Pin 19 TSSOP Pin 23 / QFN Pin 21 TSSOP Pin 26 / QFN Pin 24 No Connect Pins. The AT97SC3205T TSSOP package has additional pins which are no connects and can be tied to GND, VCC, or left floating at the customers discretion: NC – TSSOP Pin 5 NC – TSSOP Pin 12 NC – TSSOP Pin 13 NC – TSSOP Pin 14 NC –...

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Block Diagram ROM Program EEPROM Program AVR 8-bit RISC CPU PP/GPIO GPIO Express-00 SM_DAT SM_CLK EEPROM Data CRYPTO Engine Timer Physical Security Circuitry Communication to and from the TPM occurs through a 400kHz Fast mode/100kHz Standard mode. The TPM includes a hardware random number generator, including a FIPS certified Pseudo Random Number Generator which is used for key generation and TCG protocol functions. The RNG is also available to the system to generate random numbers which may be needed during normal operation. The device uses a dynamic internal memory management scheme to...

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Ordering Information Ordering Code Operational Range Lead-free, RoHS Please see the AT97SC3205T datasheet addendum for the complete catalog number ordering code.

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Package Drawings SEATING PLANE SIDE VIEW COMMON DIMENSIONS (UNIT OF MEASURE=MM) SYMBOL 3. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm. Note: 1. Refer to JEDEC drawing MO-153,variation AE 2. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,protrusions or gate burrs shall not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion...

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COMMON DIMENSIONS (Unit of Measure = mm) BOTTOM VIEW NOTES : 1. DIMENSIONING AND TOLERANCING CONFORME TO ASME Y14.5M - 1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS, 0 IS IN DEGREES. 3. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL TIP. IF THE TERMINAL HAS THE OPTIONAL RADIUS ON THE OTHER END OF THE TERMINAL, THE DIMENSION b SHOULD NOT BE MEASURED IN THAT RADIUS AREA. 4. MAX. PACKAGE WARPAGE IS 0.05 mm. 5. MAXIMUM ALLOWABLE BURRS IS 0.076 mm IN ALL DIRECTIONS. 6. THIS DRAWING CONFORMES TO JEDEC REGISTERED OUTLINE MO-220 Package Drawing...

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Comments Initial summary document release.

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XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA © 2014 Atmel Corporation. / Rev.: Atmel-8883AS-TPM-AT97SC3205T-Datasheet-Summary_022014. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by...

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