HYAMP 3200

HYAMP 3200

HYAMP 3200

Product catalog summary
Overview: The HYAMP® is a leading production line ground bond instrument designed for data-driven results and flexibility in testing environments. It supports both AC and DC ground bond testing up to 40 A and is lightweight, making it suitable for laboratory and production line applications.
Available Interfaces: The instrument includes USB for data transfer, RS-485, and barcode capability for associating products with test files. It also supports PLC remote control and has on-board data storage for up to 1,500 test results.
Safety & Productivity Features: Key features include a remote safety interlock, FailCHEK™ for failure detection, advanced user security with customizable ID and password protection, and a multi-language user interface. It also offers 4-wire measurement for accurate milliohm readings and interconnection with the Hypot® Series for a complete test system.
Input Specifications: The instrument operates on 100 – 120 VAC or 200 – 240 VAC with a frequency of 50/60Hz. It uses a 10 A slow blow fuse.
Ground Bond Test Mode: The output voltage ranges from 3.00 – 8.00 VAC/DC with a resolution of 0.01 VAC/DC. The output current ranges from 0 – 40.00 A with varying resistance ranges depending on the current. The instrument provides high and low limit settings for resistance and voltage, with dwell time settings from 0 to 999.9 seconds.
General Specifications: The HYAMP® includes remote control and signal I/O through two 9-pin connectors, supports multiple languages, and allows for multiple user setups with security features. It measures 8.5" x 3.5" x 11.9" and weighs 11 lbs.
Additional Information: The document explains the use of "counts" in specifications, which refers to the lowest resolution of the display for a given measurement range.
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Catalog excerpts

HYAMP 3200-1

The Industry Leading Production Line Ground Bond Instrument AVAILABLE INTERFACES RoHS 3 Our HYAMP® Series provides manufacturers with data-driven results and greater test flexibility required in today’s complex test environment. Quickly collect test data and test settings from the convenient front panel USB port onto a standard USB flash drive. Use the front panel barcode connection to associate products with preprogrammed test files. Test with greater flexibility by performing either AC Ground Bond or DC Ground Bond at a maximum of 40 A of current. The HYAMP® features a drastically reduced weight and footprint making it the ideal lightweight Ground Bond solution for laboratory and production line testing applications. Easily interconnect with the Hypot® Series to form a complete safety compliance system. SAFETY & PRODUCTIVITY FEATURES Remote Safety Remote Safety Interlock Interlock Data Transfer Data Transfer Direct barcode connection Multiple Multiple Languages Languages Multi-Language user interface Ground Bond Voltage Drop Monitor voltage drop vs resistance FailCHEK™ FailCHEK Confirms failure detection Prompt & Hold Prompt & Provides alerts Hold & instructions between tests Advanced Advanced User Security User Security 4-Wire Measurement More accurate milliohm measurement Interconnection Interconnect Interconnect with Hypot® to form a complete test system On Board Data Data Storage Storage RS-485 Save up to 1,500 Test Results on-board WithStand WithStand® Automation Compatible Basic PLC relay control Barcode Barcode Capability Capability Find the Model that Fits Your Testing Needs Ground Bond Accredited calibration options available Easily disable HV output Easily import/ export test files and data via USB Customize ID & password protection Visit Us Online arisa

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HYAMP 3200-2

HYAMP ® GENERAL SPECIFICATIONS INPUT SPECIFICATIONS Voltage Output Frequency Output Current Range: Resolution: Accuracy: Resolution: Accuracy: Maximum Loading 3.00 – 8.00 VAC/DC 0.01 VAC/DC ± (3% of setting + 3 counts) 50 or 60 Hz, User Selectable/DC Range: Range: Resolution: Accuracy: Dwell Time Setting Resolution: Accuracy: The following input and output signals are provided through two 9 pin D type connectors: Inputs: Test, Reset, Hardware Interlock, File Recall Outputs: Pass, Fail, Test-in-Process, Reset-Out, Start-Out Hardware Interlock (safety) GROUND BOND TEST MODE Output Voltage (Open...

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