SIPLACE CA2 High-speed chip assembly directly from wafer and SMT placement in one machine

SMT AND DIE BONDING: SIPLACE CA2 THE HYBRID SIPLACE CA2 HIGH-SPEED PLATFORM REVOLUTIONIZES SiP PRODUCTION Only consistent miniaturization and increasingly complex electronics make things like smart devices, autonomous driving and the 5G communication standard possible. The key technology is system-in-package (SiP) because it combines ICs and SMT components into a compact, highly innovative system. As a hybrid combination of a SMT placement machine and a die bonder, the new SIPLACE CA2 can process SMDs supplied from changeover tables and feeders as well as dies taken directly from a sawn wafer...

MULTITALENT COMBINES TWO WORLDS IN ONE MACHINE Access for Overhead Hoist Transport Maximum productivity Wafer Exchange Unit with wafer swap in 10 seconds Processes SMT components and dies directly from the wafer with die-attach and flip-chip processes in the same work step. Cost-saving No taping cost, no associated quality cost of the die taping process and no efforts for tape-waste disposal. Drawer for wafer magazi ne Unique flexibility Wafer system for up to 50 different wafers with a wafer swap time of less than 10 seconds (“full multi-die capability”). A wafer chuck, flux (linear) dipping...

SIPLACE CA2 SIPLACE CA2 Placement speed (benchmark) SMT Flip chip from wafer Die attach from wafer Wafer swap 20 μm / 15 µm / 10 μm (can be selected on placement position and component shape level) 50 mm × 45 mm to 375 mm × 260 mm (dual-lane mode) 50 mm × 45 mm to 375 mm × 430 mm (single-lane mode) Feeder slots up to 80 × 8-millimeter tape-and-reel feeder or up to 2 × Multi Wafer System and 10 × 8-millimeter tape-and-reel feeder Power consumption (average) CE, SEMI S2/S8, Clean room class ISO 7 Data interfaces Placement head Component range from tape-and-reel: 0201m up to 8.2 mm × 8.2 mm from...