ENABLING THE DIGITAL WORLD Process Lens Measure what matters – with exceptional precision, speed and stability

Process Lens MORE PRECISION, SPEED, AND INVESTMENT PROTECTION Process Lens is a highly precise, flexible, state-of-the-art 5D inline SPI system with onthe-fly 3D compensation of PCB warping. It is fast enough even for inline measurements with dual conveyors. Thanks to its smart algorithms, the Process Lens understands what it measures and knows how to interpret the results accordingly. It measures what matters: solder paste deposits, glue, contaminations, dust, and more – all while suppressing any measurement noise generated by the circuit board. The choice is yours: the Process Lens has a DLP...

TOTALLY UNIQUE Process Lens The most Innovative measurement system Moiré phase shifting with 8 or 20 million digitally controllable micromirrors Maximum accuracy Precise X/Y positioning, combined 2D/3D measurements and on-the-fly compensation of board warpage Shadow-free Multiple light sources Comprehensive Visualization of position, area, height, volume and shape of all solder deposits; checks for coplanarity and bridging Maximum throughput Inline measurement in dual-conveyor mode Easy operation Quick programming with component library and recommendations of inspection criteria Investment protection...

Process Lens / Process Lens HD Machine type Process Lens Camera system Pixel size 10 μm × 10 μm (high-resolution mode) 20 μm × 20 μm (high-speed mode) Vertical resolution Height accuracy with calibration target Paste deposit size Inspection speed Solder paste measurements Volume, area, height, X- and Y-offset, shape, bridging, coplanarity 70 μm × 125 μm (high-resolution mode) 130 μm × 200 μm (high-speed mode) 90 cm²/s (high-speed mode) PCBs Dimensions – single lane Dimensions – dual lane (standard) Dimensions – dual lane (in single-lane mode) Minimum edge clearance Maximum weight Maximum PCB...