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Process Lens Measure what matters – with exceptional precision, speed and stability

Process Lens Measure what matters – with exceptional precision, speed and stability

Process Lens Measure what matters – with exceptional precision, speed and stability

Product catalog summary
Overview: The document introduces the Process Lens, a state-of-the-art 5D inline Solder Paste Inspection (SPI) system designed for precision, speed, and stability in the printing process. It highlights the system's ability to measure critical parameters such as solder paste deposits, glue, and contaminants while minimizing noise.
Key Features:
  • Precision and Speed: The Process Lens uses a DLP chip with 8 million micromirrors, while the Process Lens HD features 20 million micromirrors, offering up to 70% faster performance with high accuracy and reduced false calls.
  • Flexibility: Users can switch between high-speed and high-resolution modes, providing adaptability to different production needs.
  • Advanced Software: The optional WORKS Process Expert software transforms the system into a self-learning inline expert system, optimizing the printing process autonomously.
  • Comprehensive Measurements: The system provides detailed visualization of solder deposits, including volume, area, height, and shape, and checks for coplanarity and bridging.
Technical Specifications:
  • Camera System: 4 MP for Process Lens and 25 MP for Process Lens HD, with varying field of view and pixel sizes.
  • Inspection Speed: Up to 30 cm²/s for Process Lens and 90 cm²/s in high-speed mode for Process Lens HD.
  • PCB Compatibility: Supports single and dual-lane configurations with specific dimensions and thickness ranges.
  • Machine Dimensions: Length × Width: 1,130 × 1,300 mm; Height: 1,600 mm; Weight: 780 kg.
Benefits: The Process Lens system ensures more stable printing processes, higher throughput rates, and significantly better yields, offering unmatched performance compared to traditional systems.
Conclusion: The Process Lens and Process Lens HD provide a unique combination of precision, speed, and flexibility, making them ideal for modern manufacturing environments seeking to optimize their printing processes.
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Catalog excerpts

Process Lens Measure what matters – with exceptional precision, speed and stability-1

ENABLING THE DIGITAL WORLD Process Lens Measure what matters – with exceptional precision, speed and stability

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Process Lens Measure what matters – with exceptional precision, speed and stability-2

Process Lens MORE PRECISION, SPEED, AND INVESTMENT PROTECTION Process Lens is a highly precise, flexible, state-of-the-art 5D inline SPI system with onthe-fly 3D compensation of PCB warping. It is fast enough even for inline measurements with dual conveyors. Thanks to its smart algorithms, the Process Lens understands what it measures and knows how to interpret the results accordingly. It measures what matters: solder paste deposits, glue, contaminations, dust, and more – all while suppressing any measurement noise generated by the circuit board. The choice is yours: the Process Lens has a DLP...

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Process Lens Measure what matters – with exceptional precision, speed and stability-3

TOTALLY UNIQUE Process Lens The most Innovative measurement system Moiré phase shifting with 8 or 20 million digitally controllable micromirrors Maximum accuracy Precise X/Y positioning, combined 2D/3D measurements and on-the-fly compensation of board warpage Shadow-free Multiple light sources Comprehensive Visualization of position, area, height, volume and shape of all solder deposits; checks for coplanarity and bridging Maximum throughput Inline measurement in dual-conveyor mode Easy operation Quick programming with component library and recommendations of inspection criteria Investment protection...

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Process Lens Measure what matters – with exceptional precision, speed and stability-4

Process Lens / Process Lens HD Machine type Process Lens Camera system Pixel size 10 μm × 10 μm (high-resolution mode) 20 μm × 20 μm (high-speed mode) Vertical resolution Height accuracy with calibration target Paste deposit size Inspection speed Solder paste measurements Volume, area, height, X- and Y-offset, shape, bridging, coplanarity 70 μm × 125 μm (high-resolution mode) 130 μm × 200 μm (high-speed mode) 90 cm²/s (high-speed mode) PCBs Dimensions – single lane Dimensions – dual lane (standard) Dimensions – dual lane (in single-lane mode) Minimum edge clearance Maximum weight Maximum PCB...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.