Advanced Packaging
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WLP INSPECTION, TEST & PACKAGING End-to-end solution chains for WLSiP

Advanced Packaging/WLSiP The whole solution chain from a single source E-forming produces the finest multi-level apertures The printing solution for advanced-packaging processes: DEK Galaxy Truly unique: SIPLACE CA combines bare-chip and SMT placement The efficient encapsulation solution in advanced packaging: ORCAS Simply clever: Molding with keep-out zone (KOZ) More precision and efficiency: Singulation with the LASER 1205 multi-beam system Finalizing your WLP/PLP processes: SUNBIRD for inspection, sorting and taping Invest in a growth market

Advanced Packaging/WLSiP Separately in the past, now combined. In the past, the semiconductor - especially in back-end packaging operations - and SMT production industries operated separately from each other. In advanced packaging, their processes overlap for the first time. The result: Besides OSATs, classic electronics manufacturers can help out the semiconductor industry by supplementing its operations to meet the exploding demand for ultra-compact, SMT-capable function modules. This opens up an attractive growth market for the electronics production industry. Only at ASM: Everything...

EFORM STENCIL TECHNOLOGY Ultra-precise multi-level stencils DEK Galaxy The solution for printing and bumping DIE ATTACH & SMT SIPLACE CA Combined placement from wafers and SMT feeders The process chain for SiP applications combines classic semiconductor and SMT processes. Deposition The first process step is the deposition of flux and solder paste on the substrate. Thanks to ASM's innovative printing technologies, this can be done quickly and efficiently with the precision required for wafer-level operations. Multilevel e-formed stencils have become the standard for this process. With...

Flexible molding Precise and efficient Highly efficient all-in-one laser-cutting solution Molding Next, the substrates with the SiPs is molded, usually via press-forming with epoxy. For these and the subsequent SiP process steps such as redistribution layer in thin-layer technology, proven tools from the semiconductor industry is normally used, which explains why most SiP processes operate with wafer-shaped panels. Singulation In the singulation process, classic saws have been replaced by laser-based solutions, because they are faster and more accurate. Even more modern...

Stencil Technology E-forming produces the finest multi-level apertures The assembly of ultra-compact SiP designs requires maximum precision and extremely thin stencils with ultra-fine apertures. This is the only way to achieve the area ratio parameters that permit a reliable release of the print media and ensure a stable printing process. In addition, specially developed multi-layer stencil technology is used to place solder balls directly on the substrate. In a first step, flux is applied, which is important for the soldering process. Next, the solder balls for the SMT components are...

Mask Photoresist Electrodeposition process Seed layer Substrate Photoresist molds Electrolytic solution Electroformed metals Metallic microstructure Source: Wikipedia ELECTROFORM STENCIL PRODUCTS SPECIFICATIONS Platinum Stencil Product Range Aperture (hole) size tolerance Aperture positional tolerance distance < 50 mm ±50 µm > 50 mm 0.1 µ/mm (VG) , 0.3 µ/mm (mesh mounted) Thickness tolerance Thickness checking Scan (presence/absence) RECOMMENDED PRINT APPLICATIONS semiconductor packaging wafer level printing LED and/or trace printing high accuracy printing multi layer stencil aperture sizes...

Printing & Ball Drop The printing solution for advanced packaging processes: DEK Galaxy Advanced packaging places extremely high demands on the printing process, because it requires ultra-fine apertures and maximum precision along with separate printing steps involving different technologies and media. With the DEK Galaxy, our printing experts have developed an extremely powerful, modular and flexibly configurable solution for use in advanced-packaging processes. Precise linear motors and a stable frame ensure maximum precision even at high printing speeds. In addition, ASM offers a variety...

Flux and solder paste Ball drop With the first two printing processes, flux or solder paste are applied to the substrates via classic stencil printing with multi-level DEK e-form stencils. The versatile DEK printer software makes it easy to adjust all relevant operating parameters. For the ball drop process, i.e. the application of solder balls onto the underside of the SiPs, the DEK Galaxy provides another solution. With its DirEKt Ball Placement Option, solder balls can be applied individually (ball attachment). DEK Galaxy Reliable printing in chip assembly ▪ For demanding wafer,...

High Precision Chip Placement Truly unique: SIPLACE CA combines bare-chip and SMT placement Do you combine bare-die placement with the placement of classic SMT components in your production? Or in other words: are you looking for a universal machine that you can use to populate large carriers in panel level packaging as well as for classic SMT placement applications? These processes used to be strictly separate – until now. Today, ASM is the first equipment maker that can offer you more: the SIPLACE CA. This uniquely innovative solution tears down the borders between semiconductor backend...

Flexible wafer modules enable you to feed the SIPLACE CA in Die Attach and Flip Chip process directly from the wafer and transfer them to panels with exceptional speed and precision. And thanks to its flexible conveyor, you can process substrate-swith sizes of up to 650 mm x 700 mm. These features are not the only strengths of the SIPLACE CA. It also handles the whole spectrum of classic SMT components via tapes and feeders and does it all with breathtaking speed. With its four SIPLACE SpeedStar heads, the SIPLACE CA processes up to 100,000 SMT component, 42,000 flip-chips or 28,000...