Silicon Processing Tools for Solar Cells
9Pages

SILICON PROCESSING TOOLS for SOLAR CELLS Processes of Silicon Wafers -1 Diamond Electroplated Band Saw - 3 Diamond Metal Band Saw - 4 Diamond Electroplated Wire - 8 ■Diamond Electroplated Band Saw 9*'^ BOD Blade Silicon Wafer ■Diamond Electroplated Wire I Diamond Metal Bond Wheel ■Diamond Resin Bond Wheel ■Diemenu Ekchoplated Band Saw ■Diamond Metal Band Saw ■Diamond Electroplated Wire « Pro cesses of Silicon Wafers » Diamond BwhtiHlifd Band Saw Diamond HstU Bind Saw Diamond EJertDolitetl Wire W> jmond EstngitM Band Saw Mb amvii EhtXupliH Wire Multicrystalline Silicon Block

Electroplated Diamond Band Saw Blades Several blade edge designs are available and se- lection depends on material to be cut and cutting conditions. Electroplated blades allow for accu- rate cutting and improved saw efficiency with reduced kerf loss. Size Table *Please consult with our salesmen for details to determine band configuration. Blade Edge Shapes Segmented Type (Half Moon Type) ♦ For cutting hard and brittle materials ♦ Superior tool life and cutting ability in MONO silicon processing ♦ Allows greater flexibility in customizing blade edge width and pitch Serrated Type ♦ Wide width...

For Cropping and Squaring MONO and MULTI crystalline silicon ingots for the PV industry. Electroplated and Metal Bond Diamond Band Saw Blades are available. Metal Bond Diamond Band Saw Blades Long-lasting metal bond saw blades can cut large workpieces with high accuracy using high strength steel core and optimum segment design. Size Table

IOD Blades for MONO&MULTI crystalline Silicon Ingots and Bricks Used for end-cutting, removing brick inclusions and squaring MONO and MULTI silicon. ♦ Squaring MONO silicon ingot ♦ Squaring and end-cutting MONO seed silicon ♦ End-cutting MULTI silicon bricks to remove inclusions Cutting Condition Size Table * Please consult with our salesmen for details to determine wheel configuration.

I ID Blades for MONO&MULTI crystalline Silicon Ingots and Bricks Used for cropping MONO and MULTI silicon ID blades are high-tensile strength thin blades with electroplated diamond edge. Advantages of ID blade slicing are cuts with high accuracy, supe- rior flatness and minimal kerf loss. Size Table ♦ Coolant supply is crucial during the cut. * Maintain optimum blade condition with periodic dressing using recommended dressing sticks.

Used for grinding bricks to final size. Metal bond and Resin bond wheels are available to fit all ma- chine makes. Bond Type : CD Metal Bond Wheels Mainly used for rough grinding. Metal matrix such as Cu, Sn, Fe and Co secures diamond particles firmly for long wheel life. © Resin Bond Wheels Mainly used for finish grinding. ♦ Thermal cured resin matrix for good grinding ability and superior brick finish ♦ Polyimide bond for heavy grinding ♦ "BRIGHTSTAR" bond for super finish Slot / applicable #Please consult with our salesmen for details. Case Studies Work piece : 156D MUTI Silicon Bricks *...

Electroplated Wire EcoMEP" Watering / Squaring / Crop EcoMEP Diamond Wire for cutting and wafering silicon and hard, brittle materials such as sapphire. Using electroplating to secure diamond particles to high tensile strength wire, EcoMEP fixed abra- sive wire is superior to conventional slurry slicing by dramatically reducing process time, improving sub-surface damage and improving overall yield. Using water-based coolants enables possible reclaim and recycling of cutting chips, lowering 1. Lower overall cost of ownership ♦ Reduce process time ♦ More wafers per ingot => Possibility to...

Asahi Diamond Industrial Co., Ltd. The New Otani Garden Court, 11 th Floor 4-1, Kioi-cho, Chiyoda-ku, Tokyo 102-0094, Japan Tamagawa Factory Chiba Tsurumai Factory Vamanashi Asahi Diamond Industrial Co., Ltd. •The contents of this catalogue are subject to change without notice. Printed in Japan