SILICON PROCESSING TOOLS for SEMICONDUCTORS
13Pages

ASAHI DIAMOND SILICON PROCESSING

Manufacturing Process Manufacturing Processes I Vitrified Bond Wheels I Resin Bond Wheels Back Grinding Manufacturing Processes I Chemical Mechanical Polishing Conditioner I Metal Bond Wheels ■ Manufacturing Processes for Silicon Semiconductors- 1 □ Grinding Wheels for Silicon Ingots- 5 ■ Diamond Electroplated Wire (EcoMEP)- 6 ■ Notch Grinding Wheels- 8 □ Chemical Mechanical Polishing Conditioner-9 ■ Grinding Wheels for Silicon Wafers-10

Diamond Band Saws Diamond band saws are used in the process of cropping silicon ingots. In addition to this, they are also put to various other uses, such as cutting carbon and fused silica glass. Electroplated band saws By selecting the blade edge electroplate pattern best suited for the material to be grinded or the condition of use, it is possible to achieve high-precision cutting with high efficiency.

The ID blade is a blade with a high tensile strength stainless-steel core and diamonds fixed onto the thin, nickel-electroplated inner circumference. It is mainly used for cropping and slicing monocrystal line silicon ingots. The thin blade requires less cutting margin and achieves a high cutting efficiency. In addition, it produces high-precision and highly-flat cutting

Grinding Wheels for Silicon Ingots Peripheral grinding, orientation flat processing, notch grooving Metal bond wheels are used for the peripheral grinding of silicon ingots, or processing orientation flats to show the crystal orientation and processing notches. Based on our past experience in various field, we provide wheels that fulfill the needs of our clients and fit the machines they are using. Main specifications for peripheral grinding and orientation flat processing * *These represent standard specifications for silicon ingots. We also provide products customized to other...

Diamond Electroplated Wire (EcoMEP) EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can...

Edge Grinding Wheels Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of silicon wafers, which requires uniform sharpness in addition to precision accuracy in the shape of the wheel and abrasion resistance. We are able to provide a wide variety of specifications, including single grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding. ■ Shape of the diamond layer Please refer to the figures on the right.

Notch Grinding Wheels Small-diameter formed wheels are used to finish the notches of large-diameter wafers. Our notch grinding wheels maintain the run out accuracy of diamonds to the shank, and realize a favorable wafer circumference. As with our edge grinding wheels, we are able to provide a wide variety of specifications, including single-grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding.

Chemical Mechanical Polishing Conditioner The CMP (chemical mechanical polishing) process has been introduced into the smoothing technology used for LSI manufacturing. Elements are becoming increasingly miniaturized and wiring is becoming multilayered in order to improve the function and speed of semiconductor devices. Conditioners for getting the pad surface back into optimal condition are considered an important consumable component, together with pads and □ Main technical developments • Improved polishing rate -> Review of the selection • Scratch control -> Control in the falling of...

Grinding Wheels for Silicon Wafers Grinding wheels for silicon wafers are used to process silicon wafers (including compound semiconductors) Diamond wheels for back grinding are used to grind the back side of silicon wafers in order to improve the quality of the processing and reduce grinding damage. It also makes it possible to shorten the processing time because it lightens the polishing process. * Grit size over #30000 are also available (please inquire). We offer two types of bond that provide cutting sharpness and improved processing quality: a vitrified bond with high rigidity and a...

Dicing Blades Hub-type electroformed blades are used for dicing patterned wafers. Because they have aluminum alloy hubs, they can be used more easily than ring-type blades. Not only can the specifications for our dicing blades be set according to the client's needs, but the blades can also handle materials wafers with metallic blade edges. □ Examples of main specifications *These represent standard specifications. We also provide products customized to other specifications or processed materials (please inquire). The HD Blade for shortening precut times (grit size: from #3000) Because of...

Cutting Wheels for Packages Precision cutting wheels are used to cut packaged electronic parts. Specifications for our cutting wheels can be set according to the client's needs and the type of and materials used for their packages. Our cutting wheels are also used for processing a wide range of materials other than packaged parts, such as magnetic materials, laminated ceramics and glass materials (including combined materials). Representative specifications *These may differ according to the type, materials and size of the package. □ Special cutting wheels Highly elastic metal bond cutting...

Asahi Diamond Industrial Co.. Ltd. The New Otani Garden Court, 11 th Floor 4-1, Kioi-cho, Chiyoda-ku, Tokyo 102-0094, Japan Tamagawa Factoiy Chlba Tsurumal Factoiy Yamanashi Asahi Diamond Industrial Co., Ltd. •The contents of this catalogue are subject to change without notice. Printed in Japan