Precision Cutting Tools
18Pages

ASAHI DIAMOND Precision Cutting Tools

Asahi Diamond is a World-wide Brand Digital equipment keeps improving day by day, increasing the importance of precision grinding/cutting technologies as a key element of the production process. With continued miniaturization while increasing capacity of the PC and wireless devices, they have become an essential house hold appliance. Due to the increased awareness of conservation and the use of alternative clean energies, the use of solar energy is very popular, increasing the demands for larger panels and efficient methods of manufacture. Many different materials are advancing various...

INDEX Sintered blades Metal bond Resin bond Electroforming blades Hub type Ring type Ring type With steel core type Sintered cutting wheels Electroplated wire Band saws Band type selection by materials Electroplated /Metal bond band saws Selection guide of diamond and bond specification by application 15 Global Network

Asahi Diamond Industrial Co., Ltd. Sintered blades Metal bond (AD-2U) Metal bond blades, using sintered metal powder as the bonding agent, have the excellent ability to hold its shape for a longer period of time and increase the life of the blade. Standard metal bond (Bond label: M303, MST) Standard metal bond blades are used for high precision grooving/cutting of materials such as; semiconductor packages, glass, ceramics, and magnetic materials used in the hard drive industry. High rigidity metal bond (Bond label: TC, TCR) High rigidity metal bond blades cut equivalent to electroformed...

Resin bond (AD-2U, AD-2J) Resin bonded blades have excellent cutting ability that help reduce chipping, fractures, and achieve smooth surface finish. Various bond types and controlled diamond concentration make resin bond blades suited for dicing of hard, fragile material. Applications: Crystal, ceramics, glass, etc. Specifications and sizes Specification code Abrasive grain type Grit size (Mesh) Bond name Coating diamond SDC 600-100 BS472 Bond name Concentration Grit size (Mesh) Abrasive grain type Blade thickness Outer diameter Grit size (Mesh) / tolerance of blade thickness The above...

Asahi Diamond Industrial Co., Ltd. Electroforming blades Hub type (AD-2H) Hub type nickel plated blades were developed for dicing of silicon wafers, and compound semiconductor wafers such as GaAs and SiC. The aluminum hub allows for easy handling of ultra thin blades. A wide variety of standard and custom specifications are available for tough applications such as cutting ultra-thin wafers, as well as wafers with metals in the street. Specifications and sizes Specification code Grit size (mesh and µm) Core shape Steel core shape Manufacturing process Bonding hardness Concentration Bonding...

Ring type I (AD-2U) Ring type I blades are suitable for various cutting and grooving applications, such as silicon wafers, compound semiconductor wafers, etc. Nickel plating is the bonding material and with the proper diamond size, blades as thin as 15µm in thickness are available. The various specifications available, make it possible to choose the best blade for your requirements. Specifications and sizes Specification code Grit size (mesh and µm) Standard With slits Bonding hardness Grit size Bonding hardness Blade thickness Outer diameter Very soft Soft Standard Hard *The above table is...

Asahi Diamond Industrial Co., Ltd. Electroforming blades Ring type II (AD-2G) Ring type II blades are available when a blade thicker than 100µm, and larger diamond sizes are required. These nickel bond blades are more rigid and durable then metal bond blades. Suitable for cutting and grooving of ceramics, semiconductor packages, and other hard or brittle materials. Specifications and sizes Specification code Abrasive grain type Bond name Concentration Bonding hardness Grit size Abrasive grain type Bonding hardness and bond name N R Inner diameter Blade thickness Outer diameter Grit size...

With steel core type (SUNMIGHTY) (AD-2H) The SUNMIGHTY blades have a high tensile strength stainless steel core with nickel bonded diamonds on the outside edge. The recess between the core and abrasive layer help to improve coolant flow, and easy removal of the particles generated during dicing. This achieves reduced blade wear to the side of the cutting edge. Excellent for applications where tight final die size tolerance is required. Suitable for cutting and grooving of ceramics, and semiconductor packages. Close up of blade edge Specifications and sizes Specification code Abrasive grain...

Asahi Diamond Industrial Co., Ltd. Sintered cutting wheels Single type (AD-2A) Single type cutting wheels have a steel core with a diamond or CBN abrasive grain on the outer rim. Available with various selections of grains (diamond or CBN), bond (metal, resin, electroplated), cutting edge shape (V, R-shape) and core design (Straight, Under-neck relief, All relief). Multi type (AD-26) Multi set blades are best suited for mass production applications requiring high precision cutting and grooving. Asahi Diamond's advanced manufacturing technology, ensure high quality of blade edge shape, pitch...

Metal bond Specification code Abrasive grain type Bonding hardness Inner diameter Diamond layer measurement Shank thickness Blade thickness Outer diameter Bond name Concentration Bonding hardness Grit size Abrasive grain type Grit size (Mesh) The above table is our standard product line-up. If there is a combination you need and it is not listed, please contact our local sales representative. Resin bond Abrasive grain type Specification code Bond name Concentration Bonding hardness Grit size Abrasive grain type Diamond Coating diamond CBN Coating CBN Bonding hardness Inner diameter Diamond...

Asahi Diamond Industrial Co., Ltd. Electroplated wire Electroplated wire (AD-2Y) Using a unique electroplating technology Asahi is able to diamond coat high tensile wire very precisely. This manufacturing technology provides a significant improvement over conventional slurry type wire saw. Observed advantages are reduced cutting time, less kerf loss, improved flatness when sawing silicon, sapphire and other hard and brittle materials. The use of water soluble coolant can now be possible to reclaim swarf to reduce production cost and to meet ever increasing environmental requirements....