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Temperature contours on a 272-pin ball grid array package on a substrate, package data imported from MCM file “Icepak provides a quick, accurate and reliable tool for the thermal management design and analysis of our products.” Dr. Matteo Fabbri Scientist, Corporate Research ABB Switzerland Ltd. ANSYS Icepak delivers powerful technology for electronics thermal management. Simulating high-performance electronics cooling readily solves challenges in this rapidly evolving industry. Electronic devices today have smaller footprints and unique power requirements that call for superior thermal designs....

Electric potential contours on PCB trace; Joule heating of high current trace calculated as part of conjugate heat transfer solution Multi-level hex-dominant mesh of cell phone assembly; hanging-node mesh resolves small geometric details. “Icepak results gave us confidence that the same modeling approach could be applied to the entire product family. This process reduced the number of prototypes and tests, and decreased product development time by 30 to 40 percent.” Arunvel Thangamani Research and Development Schneider Electric Detailed and Compact Models for IC Packages Advanced packaging techniques,...

Velocity streamlines and temperature contours for fan-cooled avionics box exposed to solar radiation; model combines MCAD data and Icepak objects Icepak’s advanced capabilities — from meshing to solver to visualization — enable fast and accurate predictions. Robust and Rapid Numerical Solutions Temperature contours on micro lead-frame plastic quad (MLPQ) package in natural convection chamber Icepak uses the state-ofthe-art ANSYS Fluent® CFD solver for thermal and fluid-flow calculations. Icepak solves fluid flow and includes all modes of heat transfer — conduction, convection and radiation —...

Detailed thermal conductivity map for IC package substrate layer computed based on electronic trace and via information Multi-level hex-dominant mesh of fan represented directly as 3-D CAD geometry. Hangingnode mesh accurately resolves curved fan blade geometry. Automated DELPHI Extraction Icepak automatically extracts an optimized DELPHI thermal network model for different boundary condition scenarios from a detailed package model. You can easily include the optimized DELPHI model in a board- or systemlevel simulation, predicting component junction temperatures that are not a function of boundary...

Coupling ANSYS Icepak with ANSYS SIwave (left) provides additional insight into local hotspots (right) from copper resistive losses in PCBs and packages. Improve workflow efficiency and gain additional insight into product design by leveraging the ANSYS multiphysics suite. Icepak is one part of our suite that delivers state-of-the-art functionality — depth, breadth, a plethora of advanced capabilities and integrated multiphysics — providing confidence that your simulation results reflect real-world outcomes. The comprehensive range of solutions provides access to virtually any field of engineering...

ANSYS Icepak Geometry Radiation Modeling Copper Resistive Losses Mechanical CAD geometry defeatured and converted into Icepak objects with ANSYS DesignModeler Multi-level hexdominant mesh on sheet-metal heat sink represented directly as CAD geometry Temperature contours for solar load radiation with transparent surface materials Back flow into failed fan from adjacent fans causes air recirculation; fans modeled with MRF fan model Component temperatures for multi-layer PCB. Resistive losses for copper trace layers are imported from SIwave. Velocity vectors for heat sink fan assembly postprocessing...

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