• RF output frequency range: 0.6 GHz to 3 GHz
• Output IP3: 37 dBm at 2.2 GHz
• Output P1dB: 28 dBm at 2.2 GHz
• Noise figure of input amplifier: 1 dB at 2.2 GHz
• Maximum gain: 31.5 dB at 2.2 GHz
• Voltage variable attenuation range: 45 dB
• 0 V to 3.3 V attenuation control range
• Integrated bypass switch for low noise VGA
• Matched 50 Ω input stage
• 3.3 V to 5 V single supply
• 32-lead, 5 mm × 5 mm LFCSP package

• Multistandard radio receivers
• Point to point Rx and Tx
• Instrumentation
• Military and aerospace

The ADL5246 is a high-performance, low-noise variable gain amplifier (VGA) optimized for multistandard base station receivers and point-to-point receive (Rx) and transmit (Tx) applications. It features a low noise figure and excellent linearity, making it suitable for various applications. The device includes a low noise amplifier, a high linearity VGA, and a ½ W output driver stage. Gain is controlled using a unipolar control voltage from 0 V to 3.3 V. The output stage is an externally tuned ½ W driver amplifier, allowing optimization within the 0.6 GHz to 3 GHz range. The ADL5246 can be biased between 3.3 V and 5 V to balance performance and power consumption.

Operating conditions: VPOS = 5 V, TA = 25°C. The device includes three amplifiers (AMP1, AMP2, AMP3) with varying specifications across different frequencies. Key parameters include gain, input and output return loss, output 1 dB compression point, output third-order intercept, and noise figure. The device supports a frequency range of 0.6 GHz to 3 GHz with a maximum gain of 31.5 dB at 2.2 GHz.

• Supply Voltage, VPOS: 5.5 V
• Maximum RF Input Level (AMP1): 20 dBm
• Internal Power Dissipation: 3 W
• Maximum Junction Temperature: 150°C
• Operating Temperature Range: –40°C to +105°C
• Storage Temperature Range: –65°C to +150°C
• Lead Temperature Range (Soldering 30 sec): 250°C
• ESD Rating: ±1.0 kV

The thermal resistance for the 32-lead LFCSP package is specified as θJA = 16.5 °C/W and θJC = 1.15 °C/W.

The device features a 32-lead configuration with specific pins designated for ground, RF input/output, and control voltages. The exposed paddle must be soldered to a low impedance ground plane.

The document is a technical data sheet for the ADL5246, a versatile RF amplifier module. It includes detailed specifications, operational theory, and configuration guidelines for the device, which consists of three amplifiers (AMP1, AMP2, AMP3) designed for various RF applications.

The ADL5246 operates at frequencies up to 2.6 GHz and includes features such as high gain and low noise figures. The document provides gain distribution, OP1dB, OIP3, and noise figure distributions for AMP3 at 2.2 GHz, highlighting performance across different batch lots.

The device supports High Gain (HG) and Low Gain (LG) modes, with AMP2 being the key component that can be configured for different gain settings. The gain control is managed via VGAIN1 and VGAIN2, with a voltage range of 0 V to 3.3 V.

The document details the basic connections and operational theory for each amplifier. AMP1 is a low noise amplifier with internal matching, AMP2 is a variable gain amplifier with bypass options, and AMP3 is a broadband driver requiring specific matching for optimal performance.

The document provides detailed matching component values and spacing for different frequency bands, ensuring optimal performance of AMP3. It also includes schematic diagrams for basic connections and matching circuits at various frequencies.

Recommendations for PCB land patterns and thermal management are provided to ensure efficient heat dissipation. The use of thermal vias and proper soldering of the exposed paddle is emphasized.

The document describes the configuration and use of the ADL5246 evaluation board, including component options and default values. It highlights the importance of proper RF trace design and biasing for optimal performance.

For full chain operation, the document advises on precautions to prevent instability, such as shielding the VPOS2 trace and minimizing coupling between amplifiers. It also suggests using filters or attenuators to manage gain and maintain stability.

• Power Supply Decoupling Capacitors for AMP1: C5 (100 pF) must be closest to the device, followed by C40 (0.1 µF) and C41 (1000 pF).
• Bias Inductor for AMP1: L1 (100 nH) should have high impedance at operational frequency and low resistance for DC current.
• Logic Control for AMP2: VSW1 with R2, R3 (100 Ω each) for isolation and C6, C11 (100 pF each) for decoupling.
• Gain Control for VVAs: VGAIN1, VGAIN2 with R4, R5 (100 Ω each) for isolation and C14, C15 (100 pF each) for decoupling.
• AC Coupling Capacitors for AMP2: C13, C22 (100 pF each).
• Power Supply Decoupling for AMP2: C7, C16 (100 pF each) closest to the device, C2, C20 (0.1 µF each), C4, C17 (1000 pF each).
• Bias Inductors for AMP2: L2 (10 nH) and L3 (100 nH) with similar impedance and resistance requirements as L1.
• Optional Tuning Element: L5 is not installed.
• AC Coupling Capacitors for AMP3: C21, C23 (100 pF each).
• Input Matching for AMP3: L6 (1 nH) and C3 (1.5 pF).
• Power Supply Decoupling for AMP3: C24 (100 pF) closest to the device, C25 (1000 pF), C26 (0.1 µF).
• Bias Inductor for AMP3: L4 (100 nH) with similar impedance and resistance requirements as L1.
• Output Matching for AMP3: C1 (2.7 pF) and R1 (0 Ω) as a placeholder.
• Optional Components: C10, C12, C18, C19, C27 to C34, L7, L8 are not installed (DNI).

The ADL5246 was characterized using multiple samples from three batch lots, each attached to a dedicated circuit board tuned to AMP3 frequency bands. AMP1 and AMP2 operate over a broad frequency range without tuning. Characterization used an Agilent PNA-X vector network analyzer and other equipment under software control. Typical performance figures represent median performance from available samples. Circuit boards were made with Isola FR408 for low thermal expansion and attenuation. Heat management was addressed with heat sinks, reducing θJA from 16.5°C/W to 12.5°C/W, allowing operation at high temperatures.

The ADL5246 is housed in a 32-Lead Lead Frame Chip Scale Package (LFCSP_WQ) with dimensions of 5 mm x 5 mm.

Model ADL5246ACPZN-R7 operates from -40°C to +105°C and is RoHS compliant. An evaluation board (ADL5246-EVALZ) is available.