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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet

AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet
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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet

Product catalog summary
Features
The AD9993 is a mixed-signal front-end device with quad 14-bit 250 MSPS ADCs and dual 14-bit 500 MSPS DACs. It includes an on-chip PLL clock synthesizer and operates at low power consumption of 1536 mW with a 1 GHz master clock. It supports LVDS interfaces and is housed in a compact 12 mm × 12 mm lead-free BGA package.
Applications
Suitable for point-to-point microwave backhaul radios and wireless repeaters.
General Description
The AD9993 integrates four 14-bit ADCs and two 14-bit DACs, programmable via SPI. It includes FIFO buffers to manage phase differences between LVDS lane clocks and data converter sampling clocks. The DACs are designed for wide bandwidth communication system transmitters, and the ADCs are for communications receivers.
Specifications
DC Specifications: Operates with AVDD33 at 3.3 V and DVDD/AVDD at 1.8 V. Tx DAC resolution is 14 bits with a full-scale output current of 20.0 mA. Rx ADC resolution is 14 bits with a peak-to-peak differential input voltage range of 1.75 V.
AC Specifications: DAC output SFDR is 75 dBc at 20 MHz, ADC input SNR is 70 dBc at 87 MHz.
Digital Specifications: Supports CMOS input logic levels with a high of 1.8 V and low of 0.0 V. ADC and DAC LVDS data interfaces have specific voltage and skew requirements.
Functional Block Diagram
Illustrates integration of ADCs, DACs, digital controls, SPI registers, FIFO buffers, and clock generator components.
Additional Information
Includes sections on thermal resistance, ESD caution, pin configuration, performance characteristics, theory of operation, SPI port configuration, and register descriptions. Provides guidelines for power-up routines and applications information.
Specifications
Common Mode Voltage: 1.2 V, Master Clock Frequency: 200 to 1000 MHz, REFCLK Input Logic High: 1.8 V, Logic Low: 0.0 V, REFCLK Frequency: 31.25 or 62.5 MHz, SPI_SCLK Frequency: 25 MHz.
Absolute Maximum Ratings
AVSS to DVSS: -0.3 V to +0.3 V, AVDD33 to AVSS, DVSS: -0.3 V to +3.9 V, Junction Temperature: 125°C, Storage Temperature Range: -65°C to +160°C.
Thermal Resistance
Package Type 196-Ball CSP_BGA: θJA = 27.0 ºC/W, θJB = 15.4 ºC/W, θJC = 5.38 ºC/W.
Pin Configuration and Function Descriptions
Includes descriptions for AVSS, CLKP, D_VINP, C_CML, SPI_SCLK, and SPI_CS.
Typical Performance Characteristics
Receiver ADC Performance: fADC = 250 MHz, Transmitter DAC Performance: fDAC = 500 MHz.
Terminology
Defines terms like Linearity Error (INL), Differential Nonlinearity (DNL), Offset Error, Gain Error, Temperature Drift, and Settling Time.
Spurious-Free Dynamic Range (SFDR)
Difference in dB between the rms amplitude of the output signal and the peak spurious signal over the specified bandwidth.
Noise Spectral Density (NSD)
Average noise power normalized to a 1 Hz bandwidth.
Signal-to-Noise Ratio (SNR)
Ratio of the rms value of the measured output signal to the rms sum of all other spectral components below the Nyquist frequency.
Signal to Noise and Distortion (SINAD)
Ratio of the total signal power level to unwanted signal power.
Theory of Operation
Integrates four 14-bit ADCs and two 14-bit DACs with DDR LVDS data lanes and a shared clock. Control and status registers are accessed via an SPI interface.
SPI Port
4-wire synchronous serial communications SPI port for interfacing with ASICs, FPGAs, and microcontrollers.
SPI Configuration Programming
Controls the SPI interface operation, allowing configuration of data format and reset of registers.
ADC Architecture
Multistage pipelined CMOS ADC cores designed for communications receivers.
Analog Input Considerations
Differential switched capacitor circuit designed for optimum performance with a differential input signal.
DACs
Part of the high-speed CMOS DAC core family, designed for wide bandwidth communication system transmitter signal chains.
DAC Gain Setting
Each DAC has its own RFSADJ_x set resistor, with a nominal value of 1.6 kΩ.
Clocking System
Utilizes a single master clock signal for its LVDS lanes, DACs, and ADCs. The master clock can be input directly or synthesized using an on-chip PLL multiplier.
On-Chip PLL Clock Multiplier
Generates the master clock by dividing the buffered VCO output signal by 4.
LVDS Interfaces
Each DAC has seven DDR LVDS input data lanes, and each ADC has four DDR LVDS output data lanes.
Power Mode Programming
Features a POWER_MODES register to control power modes for different chip sections.
Interrupt Request Operation
Provides an ALERT signal for interrupt requests, triggered by eight different events.
Temperature Sensor
Diode-based temperature sensor measures the die temperature, accessible via specific registers.
Start-Up Register Sequences
Procedures for powering up the device using either the on-chip clock synthesizer or an external clock.
Procedures
Outlines procedures for configuring the SPI interface and aligning ADC LVDS clocks and FIFO registers.
Standards and Norms
Adheres to specific standards for SPI operations, including bit shifting and addressing modes.
Recommendations
Ensure quadrature modulator baseband inputs fall within an allowable voltage range.
Register Map
Comprehensive register map detailing address, name, description, reset value, and read/write access for each register.
Data Interpretation
Tables summarize bit descriptions for various registers, providing insights into their functions and default settings.
Critical Information
Highlights the importance of aligning FIFO pointers and synchronizing LVDS Tx DCO with data and strobe signals.
Loop Filter Control Signals Register (LF_CTRL2)
Controls the loop filter coefficients with specific bit settings for resistors and capacitors.
Synthesizer Divider Register (SYNTH_INT)
Holds the integer part of the synthesizer divider.
Clock Generator Control Registers (CLKGEN_CTRL1 & CLKGEN_CTRL2)
Manage the clock generation settings.
DAC LVDS Control Registers
Control the LVDS receiver termination and bias current adjustments for the DAC.
DAC Cores Control Register (DAC_CTRL)
Configures DAC input latch data transfer method and sets DAC common-mode level.
DAC Datapath Format Control Register (DAC_DP_FMT)
Allows selection between binary offset and twos complement data formats.
DAC IQ Calibration Control Registers
Manage the start, reset, and status of DAC IQ calibration.
PRBS Detector Control and Error Count Registers
Enable the PRBS detector and track error counts for various lanes of DAC A and B.
Temperature Sensor Registers
Provide readback and control for the temperature sensor data.
Interrupt Control Registers
Manage interrupt settings, enabling and clearing various interrupt sources.
DDS Control and Tuning Word Registers
Control the DDS tone outputs, including amplitude attenuation and tuning word settings.
Interrupt Sources
Includes warning and PLL lock/unlock interrupt sources.
Global Device Update Register
Synchronizes data transfer from master to slave registers.
Outline Dimensions
Package: 196-Ball Chip Scale Package Ball Grid Array [CSP_BGA].
Ordering Guide
Includes part numbers, temperature range, and package descriptions.
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Catalog excerpts

AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-1

Integrated Mixed-Signal Front End (MxFE) AD9993 Data Sheet FEATURES GENERAL DESCRIPTION Quad 14-bit 250 MSPS ADC SFDR = 83 dBc at 87 MHz input Dual 14-bit 500 MSPS DAC SFDR = 75 dBc at 20 MHz output On-chip PLL clock synthesizer Low power 1536 mW, 1 GHz master clock, on-chip synthesizer 500 MHz double data rate (DDR) LVDS interfaces for DACs and ADCs Small 12 mm × 12 mm lead-free BGA package The AD9993 is a mixed-signal front-end (MxFE®) device that integrates four 14-bit ADCs and two 14-bit DACs. Figure 1 shows the block diagram of the MxFE. The MxFE is programmable using registers accessed via a serial peripheral interface (SPI). ADC and DAC datapaths include FIFO buffers to absorb phase differences between LVDS lane clocks and the data converter sampling clocks. The MxFE DACs are part of the Analog Devices, Inc., high speed CMOS DAC core family. These DACs are designed to be used in wide bandwidth communication system transmitter (Tx) signal chains. Point to point microwave backhaul radios Wireless repeaters The MxFE ADCs are multistage pipelined CMOS ADC cores designed for use in communications receivers. FUNCTIONAL BLOCK DIAGRAM 2 LVDS BUFFER –ADC AND DAC DATAPATHS –CONTROLS –SPI REGISTERS –FIFO BUFFERS SPI_SCLK, SPI_CS, SPI_SDI, SPI_SDO RST CLOCK GENERATOR Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2014 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com

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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-2

Data Sheet Align ADC LVDS Clocks, ADC FIFO, DAC FIFO Register 32

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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-3

Data Sheet Bits[15:8] of Temperature Sensor Data Readback Register ... 49

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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-4

Data Sheet SPECIFICATIONS DC SPECIFICATIONS TMIN to TMAX, AVDD33 = 3.3 V, DVDD = AVDD = 1.8 V, unless otherwise noted. Table 1. Parameter Tx DAC RESOLUTION Tx DAC OUTPUT CHARACTERISTICS Offset Error Gain Error Full-Scale Output Current (IOUTFS) Output Compliance Voltage Range Output Compliance Voltage Range Output Resistance Tx DAC TEMPERATURE DRIFT Gain Reference Voltage (VREF_DAC) REFERENCE (VREF_DAC) Internal Reference Voltage Rx ADC RESOLUTION Rx ADC CHARACTERISTICS Gain Error Peak-to-Peak Differential Input Voltage Range Input Capacitance Rx ADC FULL-SCALE VREF ADJUSTMENT COMMON-MODE VOLTAGE...

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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-5

Data Sheet AC SPECIFICATIONS TMIN to TMAX, AVDD33 = 3.3 V, DVDD = AVDD = 1.8 V, DAC sampling rate = 500 MSPS and ADC sampling rate = 250 MSPS, unless otherwise specified. Table 2. Parameter DAC OUTPUT Spurious-Free Dynamic Range (SFDR) Two Tone Intermodulation Distortion (IMD3) Noise Spectral Density (NSD), Single Tone 256-QAM Adjacent Channel Power (ACP) ADC INPUT Signal to Noise Ratio (SNR) fIN = 87 MHz Spurious-Free Dynamic Range (SFDR) fIN = 10 MHz fIN = 87 MHz Two-Tone IMD3 Full Power Bandwidth Test Conditions/Comments fCENTER = 50 MHz, single carrier, 3.375 MHz offset frequency Measured...

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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-6

AD9993 Parameter CLOCK INPUT (CLKP, CLKN) Differential Peak to Peak Voltage Common Mode Voltage Master Clock Frequency REFCLK Input (REFCLK) Input VIN Logic High Input VIN Logic Low REFCLK Frequency Data Sheet Test Conditions/Comments SERIAL PERIPHERAL INTERFACE (SPI) SPI_SCLK Frequency SPI_SCLK Pulse Width High SPI_SCLK Pulse Width Low Setup Time, SPI_SDI to SPI_SCLK Rising Edge Hold Time, SPI_SCLK Rising Edge to SPI_SDI Setup Time, SPI_CS to SPI_SCLK Rising Edge Hold Time, SPI_SCLK Rising Edge to SPI_CS Data Valid, SPI_SCLK Falling Edge to SPI_SDO

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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-7

Data Sheet ABSOLUTE MAXIMUM RATINGS AVDD to AVSS, DVSS CP, A_VINP, A_VINN, B_VINP, B_VINN, C_VINP, C_VINN, D_VINP, D_VINN, VREF_DAC, FSAJ_A, FSAJ_B, CML_A, CML_B, A_CML, B_CML, B_CML, IOUTA_P, IOUTA_N, IOUTB_P, CLKP, CLKN, REFCLK to AVSS PDWN, ALERT, RST, MODE, SPI SCLK, SPI_CS, SPI_SDI, SPI_SDO to DVSS LVDS Data Inputs to DVSS LVDS Data Outputs to DVSS STROBE_P, STROBE_N to DVSS DCI_N, DCI_P, DCO_N, DCO_P Junction Temperature Storage Temperature Range Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional...

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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-8

Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 IBIAS_ TEST Mnemonic AVSS Description Analog Ground. CLKP D_VINP C_CML C_VINP B_VINP B_CML External Master Clock Input Positive. ADC D Input Voltage Positive. Common-Mode Level Bias Voltage Output ADC C. ADC C Input Voltage Positive. ADC B Voltage Input Positive. Common-Mode Level Bias Voltage Output for ADC B. Rev. A | Page 8 of 56

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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-9

Data Sheet Mnemonic A_VINP IBIAS_TEST CLKN REFCLK D_VINN D_CML C_VINN B_VINN A_CML A_VINN IOUTA_N IOUTA_P AVDD33 LDO15 CP IOUTB_N IOUTB_P AVDD Description ADC A Voltage Input Positive. Test. Connect to ground. External Master Clock Input Negative On-Chip PLL Synthesizer Reference Clock Input. ADC D Input Voltage Negative. Common-Mode Level Bias Voltage Output ADC D. ADC C Input Voltage Negative. ADC B Voltage Input Negative. Common-Mode Level Bias Voltage Output for ADC A. ADC A Voltage Input Negative. DAC A Output Current Negative. DAC A Output Current Positive. 3.3 V Analog Power Supply. On-Chip...

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AD9993: Integrated Mixed-Signal Front End (MxFE) Data Sheet-10

Description DAC B Data Input Lane 6 Positive. DAC B Data Input Lane 4 Positive. DAC B Data Input Lane 1 Positive. ADC D Data Output Lane 1 Negative. ADC D Data Output Lane 2 Negative. ADC C Data Output Lane 1 Negative. ADC C Data Output Lane 3 Negative. ADC B Data Output Lane 3 Negative. ADC B Data Output Lane 1 Negative. ADC A Data Output Lane 2 Negative. ADC A Data Output Lane 1 Negative. DAC A Data Input Lane 1 Positive. DAC A Data Input Lane 4 Positive. DAC A Data Input Lane 6 Positive. DAC B Data Input Lane 5 Negative. DAC B Data Input Lane 3 Negative. DAC B Data Input Lane 3 Positive. ADC...

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