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Tape and Reel

Tape and Reel

Product catalog summary

Overview: The document provides comprehensive guidelines and specifications for packaging Surface Mount Technology (SMT) components using tape and reel methods. It highlights the importance of proper packaging to ensure efficient processing and compliance with international standards.

Specifications: SMT components are packaged in standard tape widths of 8 mm, 12 mm, 16 mm, or 24 mm. The leads are tin-plated with pure tin (SN 100) with a thickness of 4-12 μm, ensuring good solderability even after two years of storage. Solderability is assessed according to IEC 68-2-20 or JESD22-B102-D standards.

Standards and Compliance: Tape dimensions comply with IEC 60286-3 and EIA 481-D standards. The document details polarity and orientation methods for various SMT components to ensure correct placement and functionality.

Packaging Details: Various SMT components such as TOPLED, Multi TOPLED, and Advanced Power TOPLED are listed with their respective tape sizes and reel quantities. For example, TOPLED components are available in 8 mm tapes with 2000 units per 180 mm reel or 8000 units per 330 mm reel.

Key Measurements: Detailed dimensions for tape and reel are provided in both millimeters and inches, ensuring precise packaging and handling. For instance, an 8 mm tape has a width of 8 + 0.3 / -0.1 mm and a pitch of 4 ± 0.1 mm.

Recommendations: The document recommends adhering to specified dimensions and standards to maintain the integrity and performance of SMT components during storage and processing.

Packaging Procedures: The document describes the method of taping, polarity, and orientation to ensure components are correctly aligned and secured during packaging. It emphasizes the use of cardboard carrier tapes and hold-down tapes to maintain component integrity and prevent chemical reactions affecting soldering.

Standards and Norms: References to IEC standards for tape and reel packaging ensure compliance with international norms. It specifies strength requirements for tape splices and extraction force needed to maintain component security.

Recommendations: Best practices for handling and storing moisture-sensitive components are provided, including the use of dry packs. Labeling requirements include manufacturer name, type designation, quantity, date code, packing variant, and lot number.

Key Data from Tables and Diagrams: Tables with detailed measurements and tolerances for various components ensure precise packaging. Diagrams illustrate correct orientation and polarity of components during taping, aiding in accurate assembly and insertion into automated systems.

Introduction: The document outlines procedures and materials used in the dry packing process for moisture-sensitive components, focusing on OSRAM Opto Semiconductors. It addresses risks associated with moisture-induced damage and methods to mitigate these risks.

Definitions and Abbreviations: Key terms include ESD (Electro Static Discharge), RH (Relative Humidity), and PCB (Printed Circuit Board).

Normative References: References include JEDEC-STD-020C for moisture sensitivity classification and JEDEC-STD-033B for handling moisture-sensitive devices.

Testing Products for Moisture Sensitivity: Moisture sensitivity is a critical concern for semiconductor packages, especially those using permeable plastic encapsulation. The document describes potential delamination and the "popcorn effect" during high-temperature processes, classifying moisture-sensitive components into eight groups based on JEDEC-STD-020C.

Dry Packing Process and Materials: The dry packing process involves baking the product to remove moisture, followed by sealing it in a dry pack bag with desiccants and a humidity indicator card. The dry pack bag is a three-layer laminated design compliant with MIL-STD 81705C, providing ESD protection.

Handling Dry Packed Parts: Procedures include incoming inspection, opening moisture barrier bags, rebaking devices if necessary, resealing dry packs, and storing both unpacked devices and unopened moisture-proof packs.

Dry Pack Materials:

Dry Pack Bag: A moisture barrier bag with ESD protection.
Desiccant: Exceeds military specifications, using Silica Gel and Active Clay to maintain low humidity levels.
Humidity Indicator Card: Changes color to indicate RH levels, ensuring the environment remains below 10% RH.
Dry Pack Labels: Include a Barcode-Product-Label (BPL) and a caution label indicating sealing date, moisture level, and handling guidelines.

Conclusion: Maintaining appropriate moisture levels in semiconductor packages is crucial to prevent damage during storage and processing. The document provides comprehensive guidelines and standards to ensure the integrity of moisture-sensitive components.

Specifications and Standards: The document references IPC/JEDEC J-STDx020 for level and body temperature definitions and IPC/JEDEC J-STD-033B for rebaking procedures.

Handling Dry Packed Parts:

Incoming Inspection: Moisture-sensitive components are shipped in vacuum-sealed moisture barrier bags with desiccant and a humidity indicator card. Bags should be inspected for damage upon receipt.
Opening Moisture Barrier Bags: Cut across the top of the bag carefully. Check the humidity indicator immediately after opening. If RH is less than 10%, components are ready for use. If more than 10%, rebaking is required.
Rebaking of Devices: Devices exceeding specified floor life or with RH over 10% should be baked according to IPC/JEDEC J-STD-033B. Use metal trays for baking at 65°C - 125°C.
Resealing a Dry Pack: After baking, reseal devices in moisture-proof bags. If not all components are used, reseal with original desiccant and humidity detector. Adjust floor life if exposure exceeds recommended time.
Storing Unpacked Devices: Store under conditions not exceeding 30°C and 60% RH. Use desiccator cabinets for extended storage.
Storing Moisture-Proof Packs Prior to Opening: Store at temperatures not exceeding 40°C or humidity levels of 90% RH. Storage life should not exceed 24 months.

Moisture Sensitive Level Floor Life:

Level 1: No limit
Level 2: 1 year
Level 2a: 4 weeks
Level 3: 168 hours
Level 4: 72 hours
Level 5: 48 hours
Level 5a: 24 hours
Level 6: 6 hours

Catalog excerpts

SMT components must be packed properly to assure perfect and economical processing. OSRAM Opto Semiconductors offers you, based on the in house experience, the packing in 8 mm-, SMT-Bauelemente mussen in geeigneter Form verpackt sein, urn eine einwandfreie und ökonomische Verarbeitung zu gewâhrleisten. Hier kann OSRAM Opto Semiconductors, basierend auf der "In-House-Erfahrung", die Verpackungen in 8 mm-, 12 mm-, 16 mm- oder 24 mm-Standardgurt anbieten. The leads are galvanic tin plated with pure tin (SN 100, thickness 4-12 |jm) for RoHS compliant devices, which ensures good solderability even...

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Tape dimensions in mm (inch) Reel dimensions in mm (inch) Method of Taping/Polarity and Orientation Packing Unit

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Tape and Reel Method of Taping/Polarity and Orientation Gurtausführung/Polarität und Lage Dimensions in mm (inch) Maße in mm (inch) Package Packing Unit Method of Taping Gehäuse Verpackungseinheit Gurtführung TOPLED with Lens 2000 / Rolle ∅ 330 4 (0.157) 2000 / Reel (∅ 13) Cathode/Collector Side 1.5 (0.059) 2 (0.079) 12 mm-Gurt 3 (0.118) 8 (0.315) 12 (0.472) 1.75 (0.069) 5.5 (0.217) 3.8 (0.150) 12 mm-Tape OHAY0476 TOPLED 2000 / Rolle ∅ 180 Reverse Gullwing 2000 / Reel (∅ 7) 3 (0.118) 4 (0.157) 12 (0.472) 1.75 (0.069) 8000 / Reel (∅ 13) 5.5 (0.217) 8000 / Rolle ∅ 330 12 mm-Tape 2 (0.079) 5.6 (0.220)...

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Tape and Reel Method of Taping/Polarity and Orientation Gurtausführung/Polarität und Lage Dimensions in mm (inch) Maße in mm (inch) Method of Taping Gurtführung 1000 / Rolle ∅ 180 2 (0.079) 2.05 (0.081) 4000 / Rolle ∅ 330 12 mm-Tape 4 (0.157) 4000 / Reel (∅ 13) 3.7 (0.146) 12 mm-Gurt 1.5 (0.059) 5.5 (0.217) 1000 / Reel (∅ 7) 3.5 (0.138) 2˚...3˚ 6-lead TOPLED 1.5 (0.059) Verpackungseinheit 12 (0.472) Packing Unit Gehäuse 1.75 (0.069) Package 0.3 (0.012) max. 8 (0.315) OHTY4144 Elektrisches Ersatzschaltbild siehe Produkt-Datenblatt. For alternative electrical circuit diagram refer to product data...

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Tape and Reel Method of Taping/Polarity and Orientation Gurtausführung/Polarität und Lage Dimensions in mm (inch) Maße in mm (inch) Package Packing Unit Method of Taping Gehäuse Verpackungseinheit Gurtführung SIDELED 2000 / Rolle ∅ 330 Multi SIDELED 2000 / Reel (∅ 13) 4 (0.157) Cathode/Collector Marking 12 mm-Gurt OHAY2273 4 (0.157) 8 mm-Gurt 10000 / Rolle ∅ 330 8 mm-Tape 2.4 (0.094) 1.5 (0.059) 10000 / Reel (∅ 13) 2 (0.079) 1.25 (0.049) 3.3 (0.130) Cathode/Collector Side 8.1 (0.319) 3000 / Reel (∅ 7) 1.75 (0.069) 3000 / Rolle ∅ 180 3.5 (0.138) Micro SIDELED 8 (0.315) 5.5 (0.217) 4.25 (0.167)...

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Method of Taping/Polarity and Orientation Packing Unit OSRAM OSTAR SMT Plus cathode / collector side cathode / collector side

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Method of Taping/Polarity and Orientation CERAMOS Reflector Packing Unit cathode / collector side cathode / collector side cathode / collector side cathode [ collectoc side

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Method of Taping/Polarity and Orientation Packing Unit cathode / collector side OSLON Black Series cathode side Multi CERAMOS

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Method of Taping/Polarity and Orientation Packing Unit Anode/ Collector Side cathode side

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Method of Taping/Polarity and Orientation Packing Unit cafhode side

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Method of Taping/Polarity and Orientation Packing Unit

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Tape and Reel Method of Taping/Polarity and Orientation Gurtausführung/Polarität und Lage Dimensions in mm (inch) Maße in mm (inch) Package Packing Unit Method of Taping Gehäuse Verpackungseinheit Gurtführung SMT-Photodiode 1400 / Rolle ∅ 180 KOM 2125 1400 / Reel (∅ 7) 12 mm-Gurt 12 mm-Tape OHAY2288 SMT-RLS 1000 / Rolle ∅ 180 1000 / Reel (∅ 7) 12 mm-Gurt 12 mm-Tape OHAY2275 1.5 (0.059) 4 (0.157) 2 (0.079) 12 mm Tape 2.3 (0.091) 5 (0.197) 12 mm Gurt Cathode/Collector Side 5.5 (0.217) 2000 / Reel (∅ý 7) 12 (0.472) 2000 / Rolle ∅ 180 1.75 (0.069) Smart DIL OHAY6764 SMT Radial (5 mm) 1000 / Rolle...

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Radial Components Radiale Bauelemente Packaging of Radial Taped Components on Reels The taped components are wound onto reels and supplied in cartons, with two reels to a carton. With 5 mm (T 1%) types there are 1.000 components on each reel, and with 3 mm (T 1) types Each reel and each carton is separately labeled as follows: • manufacturer's name • type designation • date code (YYWW) • Packing Variant When tapes are spliced, the splices shall be equal in strength to the original tape. The splice shall be so precise that the misalignment of the holes in each direction is no more than 0.3 mm...

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Radial Components Packaging of Radial Components in Ammopacks The component tape has a gap after every 24th component that is followed by a fold and is packed in meandering fashion into foldup cartons holding 1,500 pieces (5 mm (T 1%) type) or 2,000 Each foldup carton is labeled as follows: • manufacturer's name • type designation • date code (YYWW) • Packing Variant Polarity identification: both sides of the foldup carton are marked with - or +. The appropriate polarity is shown in the tables on Radiale Bauelemente Verpackung von radialen Bauelementen im Ammo-Pack Der Bauelemente-Gurt hat nach...

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Tape and Reel Radial Components Radiale Bauelemente At the beginning and end (leader and trailer) of the tape there are at least five gaps to simplify threading in and out of an automatic insertion system. Die Fehlmenge der Bauelemente pro Spule darf maximal 0.1% oder eine Position betragen, wobei keine aufeinanderfolgenden Plätze leer sein dürfen. Am Beginn and am Ende (Vor- bzw. Nachspann) des Gurtbandes sind zur Erleichterung des Ein- und Ausfädelns auf dem Bestückungsautomat mindestens 5 Leerstellen vorhanden. Tape and Packaging Versions Gurt- und Verpackungsvarianten Δ h ±5 o max H Lead...

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Radial Components Radiale Bauelemente

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Tape and Reel Radial Components Radiale Bauelemente Gurtung auf Spule Tape and Reel Packing Variant R N 1 8 A H +2 1) 18 (0.709 +0.079 ) Polarity Lead 1 2 Lead devices Kathode/Kollektor Cathode/Collector Polarity Lead 1 3 Lead devices Anode/Emitter Anode 2/Base Kathode/Kollektor Cathode/Collector Anode 1/Emitter Anode/Emitter Anode 2/Base Kathode/Kollektor Cathode/Collector Anode 1/Emitter Anode/Emitter Anode 2/Base Kathode/Kollektor Cathode/Collector Anode 1/Emitter Anode 1/Emitter 1) R N 1 8 C R N 2 1 A R N 2 1 C H R N 2 3 A Lead 1 Lead 2 Lead 3 F1 = 5.08 (0.2) Lead 1 Lead 2 F = 2.54 (0.1)...

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