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LB QH9G

LB QH9G
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LB QH9G

Product catalog summary
Product Overview: The LB QH9G is a CHIPLED® 0402 designed for applications in electronic equipment, gaming, textile illumination, and white goods. It features a colorless diffused resin SMT package, InGaN on Sapphire chip technology, and a typical radiation angle of 115° horizontally and 170° vertically. The dominant wavelength is 470 nm (blue), with an optical efficacy of 9.8 lm/W and a corrosion robustness class of 3B. It has an ESD withstand voltage of 2 kV according to ANSI/ESDA/JEDEC JS-001 (HBM).
Ordering Information: The product type LB QH9G-N1OO-35-1 has a luminous intensity of ≥ 28.0 mcd at IF = 5 mA, with the ordering code Q65110A8032.
Maximum Ratings: The operating and storage temperature ranges from -40°C to 85°C, with a maximum junction temperature of 90°C. The forward current at 25°C is 15 mA, and the surge current is 100 mA. The reverse voltage is 12 V, and the ESD withstand voltage is 2 kV.
Characteristics: At IF = 5 mA and TA = 25°C, the peak wavelength is 465 nm, and the dominant wavelength ranges from 464 nm to 476 nm. The spectral bandwidth at 50% Irel,max is 25 nm. The forward voltage ranges from 2.60 V to 3.10 V, and the reverse current is a maximum of 10 µA. The real thermal resistance junction/ambient is 570 K/W to 700 K/W, and junction/solder point is 350 K/W to 480 K/W.
Brightness and Voltage Groups: The product is categorized into brightness groups (N1 to R2) with varying luminous intensities and luminous flux. Forward voltage groups range from 2.60 V to 3.10 V, and wavelength groups range from 464 nm to 476 nm.
Radiation and Emission Characteristics: The document includes graphs showing relative spectral emission, radiation characteristics, forward current, and relative luminous intensity as functions of various parameters.
Soldering and Packaging: Recommended soldering under a nitrogen atmosphere is advised, and the package is not suitable for ultrasonic cleaning. The reflow soldering profile complies with MSL Level 2 according to JEDEC J-STD-020E.
Safety and Handling: The product falls into the class exempt group for photo biological safety according to IEC 62471:2006. It contains metal-filled materials, including silver, which can be affected by aggressive substances.
Disclaimer: The document includes a disclaimer about the non-assured characteristics of the component and notes on packing and recycling.
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Catalog excerpts

LB QH9G-1

Applications ——Electronic Equipment ——Textile Illumination ——Gaming, Amusement, Gambling ——White Goods Features: ——Package: SMT package 0402, colorless diffused resin ——Chip technology: InGaN on Sapphire ——Typ. Radiation: 115° (horizontal), 170° (vertical) ——Color: λdom = 470 nm (● blue) ——Optical efficacy: 9.8 lm/W ——Corrosion Robustness Class: 3B ——ESD: 2 kV acc. to ANSI/ESDA/J

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LB QH9G-2

Ordering Information  Type Ordering Code

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LB QH9G-3

Maximum Ratings Parameter Operating Temperature Storage Temperature Junction Temperature ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM)

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LB QH9G-4

Peak Wavelength Spectral Bandwidth at 50% Irel,max Viewing angle at 50% IV values for 0°, 90° Real thermal resistance junction/ambient 5)6) RthJA real Real thermal resistance junction/solderpoint 5) RthJS real

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LB QH9G-5

Brightness Groups  Group Forward Voltage Groups  Group Wavelength Groups  Group Dominant Wavelength 3) min. λdom Dominant Wavelength 3) max. λdom Group Name on Label 

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LB QH9G-6

Group Name on Label  N1

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LB QH9G-7

Relative Spectral Emission blue true green Radiation Characteristics

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LB QH9G-8

Forward current Relative Luminous Intensity

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LB QH9G-9

Forward Voltage Relative Luminous Intensity

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LB QH9G-10

Max. Permissible Forward Current IF = f(T) LT QH9G Permissible Pulse Handling Capability Permissible Pulse Handling Capability

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LB QH9G-11

Dimensional Drawing Further Information: Approximate Weight: Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)

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LB QH9G-12

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

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LB QH9G-13

Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum 2 Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature Ramp-up rate to preheat*) 25 °C to 150 °C Time above liquidus temperature Peak temperature Time within 5 °C of the specified peak temperature TP - 5 K All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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LB QH9G-16

Dry Packing Process and Materials Moisture-sensitive label or print L hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr or ct ). w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba...

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LB QH9G-17

Type Designation System Wavelength (λdom typ.) B: 470 nm S: 633 nm T: 528 nm Y: 587 nm A: 617 nm R/J: 625 nm H: 645 nm O: 606 nm G: 570 nm Emission Color blue super red true green yellow amber red hyper-red orange green Color coordinates according CIE 1931/Emission color: W: white Package Type Q: CHIPLED 0603 / 0402 R: CHIPLED 0805 N: CHIPLED 1206 / CHIPLED with lens Light emitting diode Lead / Package Properties 1: footprint: 0603 / height: 0.6 mm 3: footprint: 0603 / height: 0.35 mm 9: standard H: footprint: 0402 / height: 0.35 mm Encapsulant Type / Lens Properties 1: focusing lens (=20°) 7:...

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LB QH9G-18

Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their...

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LB QH9G-19

Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back,...

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LB QH9G-20

Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of ±11 %. Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm. Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V. Thermal Resistance: Rth max is based on statistic values (6σ). Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad) Typical Values:...

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LB QH9G-21

Revision History Version Tape and Reel Dimensional Drawing

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LB QH9G-22

Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.