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Mesa HP

Product catalog summary

Overview: The Mesa HP Nd:YAG laser is engineered for a wide array of industrial and OEM applications, offering a uniform energy distribution and high output power. It is particularly suited for micromachining due to its high-quality beam profile, pulse energy, and repetition rates.

Industry Applications: The laser is applicable in various industries including stent/glass/PCB/fine metal cutting, LCD/solar edge deletion, marking, wafer trimming, micro-hole drilling, ceramics scribing, fine wire stripping, and diamond/gemstone processing.

Scientific Applications: It is also used in scientific fields such as Ti:Sapphire pumping, particle image velocimetry, combustion analysis, laser-induced fluorescence, LIDAR, resonance Raman spectroscopy, chemical analysis of macromolecules, and laser microprobe analysis.

Key Features: The laser operates at wavelengths of 1064, 532, and 355 nm, with a smooth and symmetrical beam profile and efficient wavelength conversion. It features first-pulse suppression for consistent material processing, a compact and rugged design for 24/7 operation, and a quick diode module replacement without realignment.

Specifications: The laser specifications include power outputs at various frequencies, pulse-to-pulse stability, pulse width, beam pointing stability, beam diameter, beam divergence, beam quality, and polarization. The specifications are subject to change without notice.

Physical Layout: The laser system includes an optical head, power supply, and chiller, with specific dimensions and weights provided. The system operates within a temperature range of 15 to 35°C and a relative humidity of 8-80%.

Control Interface: The user interface includes a full-featured front panel control, RS-232 and ethernet serial interfaces, and MS Windows-based Laser Commander™ software. Rear connections include external beam enable, external trigger, analog current control, and digital alert output.

Safety Warning: The document includes a safety warning to avoid eye or skin exposure to direct or scattered laser radiation.

Catalog excerpts

The Mesa HP Nd:YAG laser is designed to accomplish demanding tasks for a broad range of industrial and OEM applications. Our pumping technology and stable optical resonator design produce a laser beam with uniform energy distribution and high output power. The high-quality profile, combined with high pulse energy and repetition rates, provide an ideal laser beam for micromachining applications. Applications Industry: > Stent/Glass/PCB/Fine Metal Cutting > LCD/Solar Edge Deletion > Marking > Wafer Trimming > Micro-hole Drilling > Ceramics Scribing > Fine Wire Stripping > Diamond/Gemstone Processing Science: > Ti:Sapphire pumping > Particle Image Velocimetry | > Laser Induced Fluorescence > LIDAR > Resonance Raman Spectroscopy > Chemical Analysis of Macromolecules > Laser Microprobe Analysis Key Features > 1064, 532, 355 nm operation > Smooth and symmetrical beam profile > Highly efficient wavelength conversion > Fist-pulse supression for consistent material processing > Compact & rugged package designed for 24/7 operation > Record 3 min. diode module replacement with no realignment necessary > Proprietary optical cavity design for optimal beam quality Amplitude

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1 All specifications at 6 kHz unless otherwise noted. 2 Typical measurement (±10%) 3 Measured at 1/e 2 points of Gaussian fit to beam profile 4 V=Vertical. Factory default (can be changed upon request)

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Mesa HP Physical Layout All dimensions are in inches (mm). Side View Power Supply Dimensions Optical Head (LxWxH) Weight Optical Head Side View Chiller Electrical Service Power Supply Temperature & Humidity Operating Temperature Specifications are subject to change without prior notice | © 08-2019 | Ref. 1264-b Top View Optical Head Control Interface User Interface Front View Side View Others 3.12 (7.9) - Umbilical Length

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Diode pumped Nd:YAG laser

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Mesa HP

Mesa HP

Catalog excerpts

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