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turion-athlon-neo-x2
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Introducing AMD TurionTM Neo X2 and AMD AthlonTM Neo X2 Dual-Core ASB1 (BGA) Processors for Embedded Applications Product Overview Shrink the design, not performance, with AMD Turion™ Neo X2 L625 and AMD Athlon™ Neo X2 L325 dual-core processors designed for embedded systems. The L625 and L325 add a new level of performance to the existing ASB1 (BGA) embedded processors. This family of embedded 64-bit processors is designed with unique computing features and a thin, compact form factor to help enable new and uncompromising designs. ASB1 processors are packaged in a small footprint, lidless 812-ball BGA (Ball Grid Array) package. The ASB1 family of processors are soldered directly to the board and reduce vertical height requirements from up to 8.6mm to 2.03mm. This enables small form factor and rugged designs to be created. ASB1 BGA Z-height from top of PCB to top of die is 2.03mm Total Stack up 2.03mm Die Substrate PCB Drawing not to scale. Refer to functional datasheets for more information PGA Z-height from top of PCB to top of die is 5.2mm (S1) or 8.6mm (AM2) Total Stack up 5.2mm Die Substrate Socket PCB Socket S1 Total Stack up 8.6mm Socket AM2 Drawing not to scale. Refer to functional datasheets for more information Additionally, the AMD Turion Neo X2 and the AMD Athlon Neo X2 ASB1 dual-core processors offer Error Correcting Code (ECC) to help deliver reliability and secure data transactions for enterprise-level designs. AMD Turion Neo X2 L625 and AMD Athlon Neo X2 L325 processors are well suited for the high end of traditional embedded designs, such as telecommunications and networking devices, ruggedized systems for military and aerospace or other field implementations, digital signage, gaming machines and industrial controls where the second core presents system designers with significant additional processing to satisfy the needs of high-end embedded markets. The AMD SempronTM 210U and 200U processors complete the product line-up, giving system designers a value single-core option to round out their product portfolio. The High Performance Platform for Compact and Rugged Embedded Systems AMD is delivering a high performance embedded platform combination that leverages the additional processing capabilities of the AMD Turion Neo X2 L625 and AMD Athlon Neo X2 L325 processors with the high bandwidth AMD 780E chipset that features full DirectX® 10, PCI Express® Generation 2, support and a high performance high definition hardware video decode into a solution targeted at high end embedded client applications. With ATI Hybrid Graphics Technology, this platform can support up to six high definition displays when two PCI Express graphics cards are added to the system. For systems that do not require high performance graphics, the L625 and L325 can be paired with the M690E+SB600 chipset. The L625 and L325 support up to four sticks of DDR2 memory (two sticks for two memory channels) either in SO-DIMM or U-DIMM form factors. Further, the memory can be soldered down, saving space and helping to reduce total system cost. ©2009 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Athlon, AMD Sempron, AMD Turion, AMD Digital Media Xpress and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. PCI Express and PCIe are registered trademarks of PCI-SIG. Windows, Windows Vista and DirectX are registered trademarks of Microsoft Corporation in the U.S. and/or other jurisdictions. MMX is a trademark of Intel Corporation. Other names are for informational purposes and may be trademarks of their respective owners.

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Introducing AMD TurionTM Neo X2 and AMD AthlonTM Neo X2 Dual-Core ASB1 (BGA) Processors for Embedded Applications Product Features and Benefits > Featuring AMD’s innovative Direct Connect Architecture for leading-edge performance by providing separate, dedicated high-speed links between processor and memory, processor and I/O, and I/O to memory, to enable predictability in real-time. > HyperTransport™ technology helps boost overall system performance through a dedicated high-speed, low-latency I/O interface. > AMD Digital Media Xpress™ technology designed for use with the largest installed...

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