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48243_ASB2_Platform_Brief_web

48243_ASB2_Platform_Brief_web
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Exceptional Performance Per Watt and Flexibility AMD Turion™ II Neo Dual-Core Processor and AMD 785E Chipset PRODUCT OVERVIEW PLATFORM FEATURES AND BENEFITS The Second Generation AMD Embedded BGA platform, featuring the AMD Turion™ II Neo dual-core processors coupled with the AMD 785E chipset, is designed to deliver exceptional performance while maintaining low average solution power draw. The new ASB2 A flexible platform that in one package offers many choices for power efficiency, visual experience with high resolution, and fully connected Internet experience with maximum multimedia capability. Delivering unprecedented high definition processors offer greater levels of performance and power efficiency over the previous generation ASB1 (BGA) processor family. This embedded 64-bit platform is designed with unique computing features and a thin, compact form factor to help enable new and uncompromising designs. The processor and chipset solution are packaged in small footprint, lidless packages making small form factor designs easy and cost effective. The growing demands of embedded applications are well served by this new platform solution through stellar performance, scalability and excellent power efficiency. Supporting single to dual-core processor scalability all under 25W TDP, HyperTransport™ 3.0 technology, PCI Express® Generation 2, DirectX® 10.1 and high definition hardware video decode into a solution targeted at high performance, yet low power embedded client applications. PERFORMANCE AMD delivers high graphics performance for low power solutions with integrated AMD Radeon™ graphics and ATI Avivo™ HD technology.1 This solution provides excellent graphics performance required for demanding embedded applications and supports enhanced operating modes for an extra boost in graphics performance. For even more graphics performance, the platform can be paired with AMD Radeon™ discrete embedded graphics processors enabling blazing fast graphics and brilliant picture quality. This combination of graphics capabilities and low power delivers the ideal computing and graphics needed for integrated digital signage, point of sale and casino gaming applications. visual experience while still maintaining a low power design. > ntegrated AMD Radeon™ HD 4200 graphics with enhanced I operating modes to enable excellent graphics performance in power and cost sensitive embedded applications > yperTransport™ technology 3.0 helps boost overall system H performance through a dedicated high-speed, low-latency I/O interface > irectX® 10.1 lets you enjoy awesome graphics performance, D stunning 3D visual effect and dynamic interactivity > nified Video Decoder for dedicated hardware decode and U playback of VC-1, and H.264 formats > emory support, integrated low voltage DDR3 memory controller M > TI PowerPlay™ 10 technology delivering high performance A features when needed and conserving power when the demand on the graphics processor is low > perating system support: O - Windows® Embedded Enterprise - Windows® Embedded Standard - Windows® Embedded Server - Windows® XP and XPe - Linux® For headless or applications not requiring intense graphics, the high throughput and low latency of the Direct Connect Architecture supported by the HyperTransport™ 3.0 technology Interface enables I/O intensive or real time applications such as industrial control and automation applications. The additional support for ECC memory makes it an excellent solution for low end server applications and applications requiring reliable data or minimum down time. Note 1: ATI Avivo HD is a technology platform that includes a broad set of capabilities offered by certain ATI Radeon graphics processors. Full enablement of some ATI Avivo HD capabilities may require complementary products.

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Key Architecture Benefits AMD64 ASB2 CORE ARCHITECTURE PERFORMANCE IMPROVEMENTS LARGE HIGH-PERFORMANCE ON-CHIP CACHE ‣ 128-bit FPU ‣ Wider instruction fetch ‣ Reduced latencies ‣ Large page support ‣ 28KB Level 1 cache per core 1 ‣ arge 1MB Level 2 cache per core L LARGE HIGH-PERFORMANCE ON-CHIP CACHE INTEGRATED DUAL-CHANNEL DDR3 MEMORY CONTROLLER WITH ECC ‣ 32KB I-Cache, 32KB D-Cache ‣ 512KB L2 per Core ‣ ompatible with high speed DDR3-800 C and DDR3-1333 ‣ ow voltage DDR3 support for reduced L power consumption ‣ Includes support for non-ECC memory INTEGRATED DISPLAY INTERFACES ULTRA LOW...

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48243_ASB2_Platform_Brief_web 2Pages

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48243_ASB2_Platform_Brief_web
2Pages